IP4305CX4/LF/P,315 NXP Semiconductors, IP4305CX4/LF/P,315 Datasheet - Page 3

• Manufacturer Part Number: IP4305CX4/LF/P,315
• Description: IC ESD PROTECTION
• Manufacturer: NXP Semiconductors

Specifications of IP4305CX4/LF/P,315

• Product: Schottky Diodes
• Configuration: Dual
• Forward Voltage Drop: 0.25 V, 0.35 V, 0.45 V
• Maximum Reverse Leakage Current: 1 uA, 8 uA, +/- 50 uA, 80 uA
• Maximum Power Dissipation: 5 mW
• Operating Temperature Range: - 30 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: WLCSP-4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
5. Design/Assembly Recommendations
Product data sheet
5.1 PCB Design Guidelines
5.2 PCB Assembly Guidelines for Pb-free soldering
250 °C
230 °C
217 °C
For the optimum performance, a Non-Solder Mask PCB design (NSMD), also known as a copper-
defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried
ground-plane layer is recommended. This results in the lowest possible ground inductance and
provides the best high frequency and ESD performance. For this case, the following are the
recommended PCB design parameters:
The following are recommendations for the assembly of this device:
Fig 3. Pb-free solder reflow profile
T
temperature
peak
PCB pad size:
Micro-Via diameter:
Solder Mask opening: 0.37 mm diameter
Copper thickness:
Copper finish:
PCB material:
Solder Screen Aperture size:
Solder Screen thickness:
Solder Paste: Pb-free:
Solder/Flux ratio:
Solder Reflow Profile:
The device is capable of withstanding at
least three reflows of this profile.
t
soak
0.20 mm diameter
0.1 mm (0.004”)
20-40 µm
AuNi
FR4
20 August 2009
Integrated dual Schottky diode array with ESD protection
t
t
3
2
t
1
0.33 mm diameter
100 µm (0.004”)
Sn Ag(3-4) Cu(0.5-0.9)
50 / 50
see below
CR ≤ 6 °C/sec
time
SYMBOL
ΔT/ Δ t
t
t
t
t
T
CR
t
soak
1
2
3
total
IP4305CX4/LF (/P)
peak
Average temperature
gradient in pre-heating
Soak time
Time at temperature
>217°C
Time at temperature
≥230°C
Time at temperature
≥250°C
Peak temperature in
reflow
Cooling rate
Total length of profile
PARAMETER
© NXP B.V. 2006. All rights reserved.
Minimum Maximum
2.5 °C/s
230 °C
REQUIREMENTS
60 s
30 s
10 s
-----
-----
----
4.0 °C/s
260 °C
-6 °C/s
180 s
150 s
540 s
50 s
30 s
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