ML610Q412P-NNNTB03A7 Rohm Semiconductor, ML610Q412P-NNNTB03A7 Datasheet - Page 89

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ML610Q412P-NNNTB03A7

Manufacturer Part Number
ML610Q412P-NNNTB03A7
Description
MCU 8BIT 16K FLASH 120-TQFP
Manufacturer
Rohm Semiconductor

Specifications of ML610Q412P-NNNTB03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
625kHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
ROHM
Quantity:
750
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
Note:
− To switch the mode of the high-speed clock generation circuit using the OSCM0 bit, stop the high-speed oscillation
− The maximum operating frequency guaranteed for the system clock (SYSCLK) of this LSI is 500kHz. The external
and set the system clock to the low-speed clock (set the ENOSC bit and SYSCLK of FCON1 to “0”).
clock that is connected to the P10/OSC0 pins must not exceed 500kHz. For more detail about the specification, see
Appendix C, “Electrical Characteristics”
6 – 4
ML610Q411/ML610Q412/ML610Q415 User’s Manual
Chapter 6 Clock Generation Circuit

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