STM32F100R6H6B STMicroelectronics, STM32F100R6H6B Datasheet - Page 82
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STM32F100R6H6B
Manufacturer Part Number
STM32F100R6H6B
Description
IC ARM CORTEX MCU 32KB 64TFBGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F100R4T6B.pdf
(87 pages)
Specifications of STM32F100R6H6B
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFBGA
Core
ARM Cortex M3
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100R6H6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Package characteristics
6.2.2
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Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
As applications do not commonly use the STM32F10xxx at maximum dissipation, it is useful
to calculate the exact power consumption and junction temperature to determine which
temperature range will be best suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.
Example: high-performance application
Assuming the following application conditions:
Thus: P
Using the values obtained in
This is within the range of the suffix 6 version parts (–40 < T
In this case, parts must be ordered at least with the temperature range suffix 6 (see
Table 53: Ordering information
Example 2: High-temperature application
Using the same rules, it is possible to address applications that run at high ambient
temperatures with a low dissipation, as long as junction temperature T
specified range.
Assuming the following application conditions:
Thus: P
Maximum ambient temperature T
I
level with I
mode at low level with I
P
P
This gives: P
P
–
T
Maximum ambient temperature T
I
level with I
P
P
This gives: P
P
DDmax
DDmax
Jmax
INTmax
IOmax
Dmax
INTmax
IOmax
Dmax
Dmax
Dmax
For LQFP64, 45 °C/W
= 82 °C + (45 °C/W × 447 mW) = 82 °C + 20.1 °C = 102.1 °C
= 175 + 272 = 447 mW
= 70 + 64 = 134 mW
= 50 mA, V
= 20 mA, V
= 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW
= 20 × 8 mA × 0.4 V = 64 mW
= 447 mW
= 134 mW
= 50 mA × 3.5 V= 175 mW
= 20 mA × 3.5 V= 70 mW
OL
OL
INTmax
INTmax
= 8 mA, V
= 8 mA, V
DD
DD
= 175 mW and P
= 70 mW and P
= 3.5 V, maximum 20 I/Os used at the same time in output at low
= 3.5 V, maximum 20 I/Os used at the same time in output at low
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
OL
OL
OL
Table 52
Table 53: Ordering information
= 0.4 V and maximum 8 I/Os used at the same time in output
Doc ID 16455 Rev 6
= 0.4 V
= 20 mA, V
scheme).
Amax
Amax
T
Jmax
IOmax
IOmax
OL
= 82 °C (measured according to JESD51-2),
= 115 °C (measured according to JESD51-2),
is calculated as follows:
= 1.3 V
= 64 mW:
= 272 mW
J
scheme.
< 105 °C).
J
remains within the