RC28F256P33BFA NUMONYX, RC28F256P33BFA Datasheet - Page 14

• Manufacturer Part Number: RC28F256P33BFA
• Description: IC FLASH 256MBIT 95NS 64EZBGA
• Manufacturer: NUMONYX
• Series: Axcell™r

Specifications of RC28F256P33BFA

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 256M (16Mx16)
• Speed: 95ns
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-EZBGA
• Cell Type: NOR
• Density: 256Mb
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 25b
• Operating Supply Voltage (typ): 2.5/3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 32M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 898897; 898897; RC28F256P33BF 898897

Table 4:
4.1
Figure 6:
Note:
Datasheet
14
RFU
DU
NC
Symbol
TSOP and Easy BGA Signal Descriptions (Sheet 2 of 2)
512-Mbit Easy BGA Block Diagram
Dual-Die Configurations
A
Die.
A[MAX:1]
Type
max
—
—
—
ADV#
WP#
WE#
OE#
CE#
CLK
= V
RESERVED FOR FUTURE USE: Reserved by Numonyx for future device functionality and
enhancement. These should be treated in the same way as a Don’t Use (DU) signal.
DON’T USE: Do not connect to any other signal, or power supply; must be left floating.
NO CONNECT: No internal connection; can be driven or floated.
IH
selects the Top parameter Die; A
Easy BGA 512-Mbit (Dual-Die) Configuration
Bottom Param Die
Top Param Die
(256-Mbit)
(256-Mbit)
Name and Function
max
= V
IL
selects the Bottom Parameter
RST#
VCC
VPP
VCCQ
VSS
DQ[15:0]
WAIT
Order Number: 320003-09
P33-65nm
Mar 2010