ZL2105ALNF Intersil, ZL2105ALNF Datasheet - Page 31

• Manufacturer Part Number: ZL2105ALNF
• Description: IC DGTL DC-DC CTRLR 3A 36QFN
• Manufacturer: Intersil
• Type: Step-Down (Buck), PWM - Voltage Moder

Specifications of ZL2105ALNF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.6 V ~ 5.5 V
• Current - Output: 3A
• Frequency - Switching: 200kHz ~ 2MHz
• Voltage - Input: 4.5 V ~ 14 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: *
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

significant bits of the address. For example, addresses
0x20, 0x25 and 0x27 are all within the same group.
Addresses 0x1F, 0x20 and 0x28 are all in different
groups. Device in the same address group can
broadcast power on and power down sequencing and
fault spreading events with each other. Devices in
different group cannot.
The Enable pins of all devices in a sequencing group
must be tied together and driven high to initiate a
sequenced turn-on of the group. Enable must be driven
low to initiate a sequenced turnoff of the group.
Refer to Application Note AN2013 for details on
sequencing via the I
6.13 Monitoring via I
A system controller can monitor a wide variety of
different ZL2105 system parameters through the
I
conditions by monitoring the SALRT pin, which will
be asserted when any number of pre-configured fault
conditions occur.
The device can also be monitored continuously for any
number of power conversion parameters including but
not limited to the following:
Please refer to Application Note AN2013 for details on
how to monitor specific parameters via the I
interface.
2
C/SMBus interface. The device can monitor for fault
Input voltage
Output voltage
Output current
Internal junction temperature
Temperature of an external device
Switching frequency
Duty cycle
2
31
C/SMBus interface.
2
C/SMBus
2
C/SMBus
ZL2105
6.14 Temperature Monitoring using the XTEMP Pin
The ZL2105 supports measurement of an external
device temperature using either a thermal diode
integrated in a processor, FPGA or ASIC, or using a
discrete diode-connected NPN transistor such as a
2N3904 or equivalent. Figure 19 illustrates the typical
connections required.
Figure 19. External Temperature Monitoring
ZL2105
Embedded Thermal Diode
ZL2105
Discrete NPN
XTEMP
SGND
XTEMP
SGND
100pF
100pF
FPGA
ASIC
March 30, 2011
DSP
µP
2N3904
FN6851.2