DSPIC30F4012-20I/SO Microchip Technology, DSPIC30F4012-20I/SO Datasheet - Page 224

• Manufacturer Part Number: DSPIC30F4012-20I/SO
• Description: IC, DSC, 16BIT, 48KB 20MHZ, 5.5V, SOIC28
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F4012-20I/SO

• Core Frequency: 20MHz
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 48KB
• Supply Voltage Range: 2.5V To 5.5V
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 48KB (16K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 20
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F401220ISO

dsPIC30F4011/4012
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70135G-page 224
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
MILLIMETERS
0.65 BSC
0.20 REF
8.00 BSC
8.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
© 2010 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
K
e
b