DSPIC30F4012-20I/SO Microchip Technology, DSPIC30F4012-20I/SO Datasheet - Page 225
DSPIC30F4012-20I/SO
Manufacturer Part Number
DSPIC30F4012-20I/SO
Description
IC, DSC, 16BIT, 48KB 20MHZ, 5.5V, SOIC28
Manufacturer
Microchip Technology
Series
DsPIC30Fr
Datasheets
1.DSPIC30F4012-30ISO.pdf
(238 pages)
2.DSPIC30F4012-30ISO.pdf
(18 pages)
3.DSPIC30F4012-30ISO.pdf
(6 pages)
4.DSPIC30F4012-30ISO.pdf
(16 pages)
5.DSPIC30F4012-30ISO.pdf
(22 pages)
Specifications of DSPIC30F4012-20I/SO
Core Frequency
20MHz
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
48KB
Supply Voltage Range
2.5V To 5.5V
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
48KB (16K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
20
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
6-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F401220ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4012-20I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F4012-30ISO PDF datasheet
- DSPIC30F4012-30ISO PDF datasheet #2
- DSPIC30F4012-30ISO PDF datasheet #3
- DSPIC30F4012-30ISO PDF datasheet #4
- DSPIC30F4012-30ISO PDF datasheet #5
- Current page: 225 of 238
- Download datasheet (4Mb)
© 2010 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
A2
A1
E1
D1
L
L1
N
D
A
E
α
NOTE 2
e
L
φ
c
b
β
E
A1
A
dsPIC30F4011/4012
MIN
0.95
0.05
0.45
0.09
0.30
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
DS70135G-page 225
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