S29AL032D90TFI000 Spansion Inc., S29AL032D90TFI000 Datasheet
S29AL032D90TFI000
Specifications of S29AL032D90TFI000
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S29AL032D90TFI000 Summary of contents
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S29AL032D Known Good Die 16 Megabit ( 8-Bit 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory Supplement General Description The S29AL032D in Known Good Die (KGD) form is 32 Mbit, 3.0 volt-only Flash memory. Spansion defines ...
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S29AL032D Features The S29AL032D Mbit, 3.0 volt-only Flash memory organized as 4,194,304 bytes or 2,097,152 words. The word-wide data (x16) appears on DQ15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. To eliminate bus contention, the device has ...
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Table of Contents General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Electrical Specifications Refer to the S29AL032D data sheet, publication number S29AL032D_00, for full electrical specifications on the S29AL032D in KGD form. Family Part Number Speed Option (V = 2.7 – 3 Max Access Time, t (ns) ACC ...
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Pad Description 3.1 Pad Relative to Die Center See pad description relative to die center in Pad Center (mils) Pad No. Signal A15 71.057 151.857 2 A14 65.954 151.857 3 A13 60.852 151.857 4 A12 55.750 ...
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Pads Relative to V See pad description relative to V Pad Center (mils) Pad No. Signal A15 66.643 303.487 2 A14 61.540 303.487 3 A13 56.438 303.487 4 A12 51.336 303.487 5 A11 46.233 303.487 6 ...
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Ordering Information Spansion standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below. S29AL032D 90 4.1 Valid Combinations Valid Combinations list configurations planned to be ...
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Packaging Information 5.1 Surftape Packaging Direction of Feed 5.2 Waffle Pack Packaging Orientation relative to top left corner of Waffle Pack cavity plate S29AL032D Known Good Die Orientation ...
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Product Test Flow Figure 6.1 provides an overview of Spansion’s Known Good Die test flow. For more detailed information, refer to the S29AL032D product qualification database supplement for KGD. Spansion implements quality assurance procedures throughout the product test flow. ...
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Physical Specifications Description Die dimensions Die Thickness Bond Pad Size Pad Area Free of Passivation Pads Per Die Bond Pad Metalization Die Backside Passivation 8. DC Operating Conditions Description V (Supply Voltage) CC Operating Temperature 9. Manufacturing Information Description ...
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Terms and Conditions of Sale for Spansion Non-Volatile Memory Die All transactions relating to unpackaged die under this agreement shall be subject to Spansion’s standard terms and conditions of sale, or any revisions thereof, which revisions Spansion reserves the ...
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Revision History Section Revision 01 (December 20, 2006) Global Initial release. Revision 02 (July 18, 2007) Packaging Information Removed references to Gel-Pak, replaced die photo Valid Combinations Table Modified table ...
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... Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2006–2007 Spansion Inc. All rights reserved. Spansion and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners ...