S29AL032D90TFI000 Spansion Inc., S29AL032D90TFI000 Datasheet - Page 9

• Manufacturer Part Number: S29AL032D90TFI000
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL032D90TFI000

• Memory Size: 32Mbit
• Memory Configuration: 4M X 8
• Ic Interface Type: CFI, Parallel
• Access Time: 90ns
• Supply Voltage Range: 2.7 To 3.6 V
• Memory Case Style: TSOP
• No. Of Pins: 40
• Memory Type: Uniform Sector Flash
• Interface Type: CFI
• Rohs Compliant: Yes
• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 90ns
• Boot Type: Top
• Address Bus: 22/21Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 4M/2M
• Supply Current: 35mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

6. Product Test Flow
July 18, 2007 S29AL032D_KGD_SP_02
Figure 6.1
to the S29AL032D product qualification database supplement for KGD. Spansion implements quality
assurance procedures throughout the product test flow. In addition, an off-line quality monitoring program
(QMP) further guarantees Spansion quality standards are met on Known Good Die products. These QA
procedures also allow Spansion to produce KGD products without requiring or implementing burn-in.
provides an overview of Spansion’s Known Good Die test flow. For more detailed information, refer
Packaging for Shipment
High Temperature
S u p p l e m e n t
Data Retention
Wafer Sort 1
Wafer Sort 3
Wafer Sort 2
Shipment
Bake
S29AL032D Known Good Die
Figure 6.1 Spansion KGD Product Test Flow
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Data Retention
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
Speed
DC Parameters
Functionality
Programmability
Erasability
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