AM29F800BB-55SF Spansion Inc., AM29F800BB-55SF Datasheet - Page 8

• Manufacturer Part Number: AM29F800BB-55SF
• Description: IC, FLASH, 8MBIT, 55NS, SOIC-44
• Manufacturer: Spansion Inc.

Specifications of AM29F800BB-55SF

• Memory Type: Flash
• Memory Size: 8Mbit
• Memory Configuration: 1M X 8 / 512K X 16
• Access Time: 55ns
• Supply Voltage Range: 4.5V To 5.5V
• Memory Case Style: SOIC
• No. Of Pins: 44
• Cell Type: NOR
• Density: 8Mb
• Access Time (max): 55ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20/19Bit
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: -40C to 85C
• Package Type: SO
• Program/erase Volt (typ): 4.5 to 5.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Word Size: 8/16Bit
• Number Of Words: 1M/512K
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 44
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CONNECTION DIAGRAMS
This device is also available in Known Good Die (KGD) form. Refer to publication number 21631 for
more information.
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
6
RY/BY#
WE#
A13
A6
A5
A9
A4
A3
A2
A7
A1
A3
RESET#
A12
A17
NC
B6
B5
A8
B4
B3
B2
B1
A4
Top View, Balls Facing Down
A14
A10
A18
NC
C6
C5
C4
C3
C2
C1
A6
A2
D A T A S H E E T
Am29F800B
A15
A11
NC
NC
D6
D5
D4
D3
D2
A5
D1
A1
FBGA
DQ7
DQ5
DQ2
DQ0
A16
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
T h e p a c k a g e a n d / o r d a t a i n t e g r i t y m ay b e
compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
E6
E5
E4
E3
E2
E1
A0
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
F6
F5
F4
F3
F2
F1
DQ15/A-1
DQ13
DQ11
DQ9
V
OE#
G6
G5
G4
G3
G2
G1
CC
DQ6
DQ4
DQ3
DQ1
V
V
H6
H5
H4
H3
H2
H1
SS
SS
21504E7 August 3, 2009