LMC662CN National Semiconductor, LMC662CN Datasheet - Page 9

• Manufacturer Part Number: LMC662CN
• Description: Operational Amplifier (Op-Amp) IC
• Manufacturer: National Semiconductor
• Type: General Purpose Amplifierr

Specifications of LMC662CN

• No. Of Amplifiers: 2
• Slew Rate: 1.1V/µs
• No. Of Pins: 8
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Mounting Type: Through Hole
• Package / Case: 8-DIP
• Rail/rail I/o Type: Rail to Rail Output
• Number Of Elements: 2
• Unity Gain Bandwidth Product: 1.4MHz
• Common Mode Rejection Ratio: 63dB
• Input Offset Voltage: 6mV
• Input Bias Current: 2fA
• Single Supply Voltage (typ): 5/9/12/15V
• Dual Supply Voltage (typ): Not RequiredV
• Voltage Gain In Db: 126.02dB
• Power Supply Rejection Ratio: 63dB
• Power Supply Requirement: Single
• Shut Down Feature: No
• Single Supply Voltage (min): 4.75V
• Single Supply Voltage (max): 15.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Technology: CMOS
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 8
• Package Type: PDIP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Application Hints
dard op-amp configurations. If both inputs are active and at
high impedance, the guard can be tied to ground and still
provide some protection; see Figure 9.
FIGURE 7. Guard Ring Connections: Non-Inverting
FIGURE 6. Guard Ring Connections: Inverting
FIGURE 5. Example, using the LMC660,
of Guard Ring in P.C. Board Layout
Amplifier
Amplifier
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The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an
insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board con-
struction, but the advantages are sometimes well worth the
effort of using point-to-point up-in-the-air wiring. See Figure
10.
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board.)
FIGURE 9. Guard Ring Connections: Howland Current
FIGURE 8. Guard Ring Connections: Follower
FIGURE 10. Air Wiring
Pump
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