PIC16F916-E/SO Microchip Technology, PIC16F916-E/SO Datasheet - Page 315
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16F916-E/SO
Manufacturer Part Number
PIC16F916-E/SO
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F913-ISS.pdf
(330 pages)
3.PIC16F913-ISS.pdf
(8 pages)
4.PIC16F913-ISS.pdf
(34 pages)
Specifications of PIC16F916-E/SO
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
352 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
352 B
Interface Type
SSP, I2C, AUSART, SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Data Rom Size
256 B
Height
2.31 mm
Length
17.87 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F913-ISS PDF datasheet #2
- PIC16F913-ISS PDF datasheet #3
- PIC16F913-ISS PDF datasheet #4
- Current page: 315 of 330
- Download datasheet (7Mb)
© 2007 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
PIC16F913/914/916/917/946
φ
E1
Units
A2
A1
E1
D1
L
L1
N
D
A
E
α
NOTE 2
e
L
φ
c
b
β
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
DS41250F-page 313
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