PIC18F448-I/L Microchip Technology, PIC18F448-I/L Datasheet - Page 385

IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LDCC,44PIN,PLASTIC

PIC18F448-I/L

Manufacturer Part Number
PIC18F448-I/L
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LDCC,44PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F448-I/L

Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-PLCC
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI, I2C, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
33
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136, DM163011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
AC164309 - MODULE SKT FOR PM3 44PLCC444-1001 - DEMO BOARD FOR PICMICRO MCUDVA16XL441 - ADAPTER DEVICE ICE 44PLCCDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
 Details
Other names
PIC18F448I/L

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F448-I/L
Manufacturer:
Microchip Technology
Quantity:
10 000
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-076
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
A2
D1
n1
A1
E1
F
E
D
B
n
p
A
L
c
n
MIN
.037
.390
.390
.004
.039
.002
.018
.463
.463
.012
.025
2
1
0
5
5
D1
L
.039 REF.
CH x 45°
INCHES
D
NOM
.031
44
11
.004
.394
.394
.043
.039
.024
.472
.472
.006
.015
.035
A1
3.5
10
10
A
F
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.30
0.64
0.09
0
5
5
MILLIMETERS*
1.00 REF.
PIC18FXX8
NOM
12.00
12.00
10.00
10.00
1.10
1.00
0.10
0.15
0.38
0.60
0.89
Revised 07-22-05
3.5
10
10
0.80
44
11
A2
DS41159E-page 383
MAX
12.25
12.25
10.10
10.10
0.44
1.14
1.20
1.05
0.15
0.75
0.20
15
15
7

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