PAQ50S48-1R8 TDK Corporation, PAQ50S48-1R8 Datasheet - Page 22

• Manufacturer Part Number: PAQ50S48-1R8
• Description: LAMBDA PART
• Manufacturer: TDK Corporation

Specifications of PAQ50S48-1R8

• Rohs Compliant: YES

PAQ
B-246
● This instruction manual describes only changed items from
There is no restriction on mounting direction but there
should be enough consideration for airflow so that heat
does not accumulate around the power module vicinity.De-
termine external components configuration and mounting
direction on PCB such that air could flow through power
module at forced air cooling or convection cooling. By
maintaining baseplate temperature below 100℃ , operation
is possible. But according to the models, output derating
is needed as shown in figure 1-1. Measure baseplate tem-
perature at center of baseplate as indicated in fig.1-2. For
better improvement of power module reliability, more derat-
ing of baseplate temperature when using is recommended.
Forced cooling to power module improve radiation capa-
bility more than convection cooling. Figure 1-3 indicates
thermal resistance value between baseplate and air at
standard vertical mounting. For details on standard vertical
mounting, refer to “PAQ-S48 Series Instruction Manual”
Figure 1-4 to 1-8 indicates power dissipation (Pd) of each
models at following condition.
An example of thermal design using these condition is
shown as follows.
the standard model’ s instruction manual.
Fig.1-2 Temperature Measuring Point of Baseplate
Note
Output Voltage:
Ambient Temperature: 60℃
Fig.1-1 PAQ100S48/B Output Derating
100
80
60
40
20
0
−40
−20
Baseplate Temperature (℃)
1.2V,1.8V model
2.5V,3.3V,5V model
0
20
PAQ100S48-*/B**Instruction Manual
Nominal value
40
60
Temperature
Measuring Point of
Baseplate
80
1. Output Derating
100
1 Example of Thermal design
Calculate minimum necessary air velocity at following con-
dition.
Use Model:
Input Voltage:
Maximum Output Current:
Maximum Ambient Temperature: 65℃
Mounting Method:
Power dissipation is as shown in Fig.1-8
Pd=9.0 (W)
Maximum baseplate temperature (Tbp) at output current
15A is as shown in Fig. 1-1
Tbp=95 (℃ )
Therefore
Tbp=Ta+θbp−a × Pd
Ta ：
Air Velocity is as shown in Fig.1-3.
Air Velocity=0.8 (m/s)
This is minimum necessary air velocity at above condition.
Measure actual baseplate temperature and verify it is
same as the design. If there are discrepancy, re-check
each condition and re-design.
Note
1） Data shown in Fig.1-3 to 1-8 is the typical value and
2） When the condition of input voltage and output volt-
η
Pin: Input Power (W)
Pout: Output Power (W)
● Please refer to “PAQ-S48 Series instruction manual” more
Equation is as follows.
θbp−a=
η :
θbp−a ：Thermal Resistance (℃ /W)
details.
● PAQ65D Instruction Manual
it changes depending on measurement condition.
Recommend to design with sufficient margin against
calculation value.
age are different and it is impossible to determine
power dissipation (Pd) from Fig.1-4 to 1-8, calculate
power dissipation as follows.
● PAQ-S Instruction Manual
Pd=Pin−Pout=
Efficiency (%)
Ambient temperature (℃ )
・All specifications are subject to change without notice.
Tbp−Ta
(Baseplate - Air)
Pd
100−η
=3.33 （℃ /W）
PAQ100S48-5/B
48V
15A
Standard Vertical Mounting
×Pout
B-237Page
B-250Page