PAQ50S48-1R8 TDK Corporation, PAQ50S48-1R8 Datasheet - Page 32

• Manufacturer Part Number: PAQ50S48-1R8
• Description: LAMBDA PART
• Manufacturer: TDK Corporation

Specifications of PAQ50S48-1R8

• Rohs Compliant: YES

PAQ
B-256
PAQ
 Storage Ambient Temperature
Abrupt temperature change would cause condensation
built-up that leads to poor solderability of terminals of the
power module.
 Storage Ambient Humidity
High temperature and humidity can cause the terminals on
the module to oxidize. The quality of the solder will become
worse.
 Cooling Method
Forced air cooling is recommended. Convection cooling is
also possible. For the details of derating, refer to “Mounting
Method and Thermal condition” .
 Ambient Temperature vs. Output Voltage Drift
Temperature coefficient is defined as the rate of voltage
change when ambient temperature is changed during opera-
tion.
 Withstand Voltage
This power module is designed to have a withstand volt-
age of 1.5kVDC between input to output. When conduct-
ing withstand voltage test during incoming inspection, be
sure to apply DC voltage. Also, set the current limit value
of the withstand voltage testing equipment to 10mA. Be
sure to avoid conducting test with AC voltage because this
would cause power module damage. Furthermore, avoid
throw in or shut off of the testing equipment when applying
or when shutting down the test voltage. Instead, gradually
increase or decrease the applied voltage. Take note espe-
cially not to use the timer of the test equipment because
when the timer switches the applied voltage off, impulse
voltage which has several times the magnitude of the ap-
plied voltage is generated causing damage to the power
module.
1 Output derating
There is no restriction on mounting direction but there should
be enough consideration for airflow so that heat does not
accumulate around the power module vicinity. Determine
external components configuration and mounting direction on
PCB such that air flow through power module from forced air
or convection cooling is not blocked. Take note, output power
derating is needed as shown in followings. (Refer to output
derating by ambient temperature.)
For actual application with difficulty of air flow measurement,
it is recommended to measure MOSFET Q15 temperature
in order to ensure the power module operates within derating
curve. (Refer to output derating by MOSFET Q15 tempera-
ture).
65D
3. Mounting Method and Thermal Condition
For testing, short all the input side together and output
side together as shown in the diagram below.
 Insulation Resistance
Use DC insulation tester (MAX 500V) between output
and input. Insulation resistance value is 100Mohm and
above at 500VDC applied voltage.
Make sure that during testing, the isolation testers does
not produce a high pulse when the applied voltage is var-
ied. Ensure that the tester is fully discharged after the test.
 Vibration
Vibration of power module is defined in case of mounting
on PCB.
 Shock
Value for the conditions of out shipping and packaging.
The output derating by ambient temperature curves provided
is based on the below set-up condition. It is therefore advis-
able to do actual thermal measurement on MOSFET Q15
before confirming the thermal design.
Fig.17-1: Withstand Voltage Test for Input-Output
Test condition: 1.5kVDC 1minute (10mA)
VOLTAGE TESTER
WITHSTAND
ISOLATION
TESTER
TOP VIEW
AIRFLOW
Fig.1-1: Mounting method
Fig.18-1: Isolation test
C L
・All specifications are subject to change without notice.
POWER
MODULE
Ta AND AIR
VELOCITY
MEASEUREMENT
POINT
＋Vin
CNT
−Vin
＋Vin
CNT
−Vin
12.7mm
25.4mm
AIRFLOW
TRM1
TRM2
TRM1
TRM2
GND
GND
PCB
Vo1
Vo1
Vo2
Vo2
PCB
POWER
MODULE