HLMP-HB55-FJ0DD Avago Technologies US Inc., HLMP-HB55-FJ0DD Datasheet - Page 9

• Manufacturer Part Number: HLMP-HB55-FJ0DD
• Description: LED Lamp
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-HB55-FJ0DD

• Color: Blue
• Forward Voltage: 3.8V
• Input Current Max: 30mA
• Led Color: Blue
• Led Gas Type: InGaN
• Lead Pitch: 2.54mm
• Leaded Process Compatible: Yes
• Lens Color: Blue
• Lens Style: (H X Dia) 7 X 5.2 Mm
• Lens Width: 5.2mm
• Millicandela Rating: 210mcd
• Current - Test: 20mA
• Wavelength - Dominant: 470nm
• Wavelength - Peak: 467nm
• Voltage - Forward (vf) Typ: 3.2V
• Lens Type: Clear, Blue Tinted
• Lens Style/size: Oval, 5mm
• Package / Case: Radial - 2 Lead
• Height: 7.00mm
• Viewing Angle: 100°, 40°
• Mounting Type: Through Hole
• Resistance Tolerance: 470nm
• Led Size: T-1 3/4
• Illumination Color: Blue
• Lens Color/style: Blue
• Wavelength: 470 nm
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Details

9
Relative Light Output vs. Junction Temperature
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• For better control, it is recommended to use proper
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is 1.59 mm
• Recommended soldering conditions:
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
process to prevent damage to LED component.
below the body (encapsulant epoxy) for those parts
without standoff.
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
Wave Soldering
105 C Max.
30 sec Max.
250 C Max.
3 sec Max.
T
J
– JUNCTION TEMPERATURE – C
0
20
Manual Solder
Dipping
–
–
260 C Max.
5 sec Max.
40
GREEN
60
• Wave soldering parameter must be set and maintained
Notes:
1. PCB with different size and design (component density)
2. Avago Technologies' high brightness LED are using high
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure the
soldering profile used is always conforming to
recommended soldering condition.
BLUE
will have different heat mass (heat capacity). This might
cause a change in temperature experienced by the board if
same wave soldering setting is used. So, it is recommended
to recalibrate the soldering profile again before loading a
new type of PCB.
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
is not exceeding 250 C. Overstressing the LED during
soldering process might cause premature failure to the LED
due to delamination.
80