VMMK-2503-BLKG Avago Technologies US Inc., VMMK-2503-BLKG Datasheet - Page 9

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VMMK-2503-BLKG

Manufacturer Part Number
VMMK-2503-BLKG
Description
GaAsCap Amplifier
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of VMMK-2503-BLKG

Current - Supply
68mA
Frequency
1GHz ~ 12GHz
Gain
13.5dB
Noise Figure
3dB
P1db
17dBm
Package / Case
0402 (1005 Metric) - 1.00mm L x 0.50mm W x 0.25mm H
Rf Type
General Purpose
Test Frequency
6GHz
Voltage - Supply
5V
Manufacturer's Type
Wideband Amplifier
Number Of Channels
1
Supply Current
88@5VmA
Frequency (max)
12GHz
Operating Supply Voltage (max)
6V
Package Type
SMD
Mounting
Surface Mount
Pin Count
3
Noise Figure (typ)
3.4@6000MHzdB
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-2217
VMMK-2503-BLKG

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Outline Drawing
Top and Side View
Bottom View
Notes:
1. x indicates pin 1
2. Dimensions are in millimeters
3. Pad Material is minimum 5.0 um thick Au
Suggested PCB Material and Land Pattern
Notes:
1. 0.010” Rogers RO4350
9
0.5 mm
.022 [0.559]
0.2mm
0.3mm
.014 [0.356]
0.7mm
0.8mm
GY
1.05mm
.008 [0.203]
.010 [0.254]
.014 [0.356]
.005 [0.127]
.020 [0.508]
Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
3. Recommended attachment is solder paste. Please
4. Apply solder paste using either a stencil printer or
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
to be worn at all times when handling these devices.
For more detail, refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control
ESD Machine Model (Class A)
ESD Human Body Model (Class 1B)
from topside if using a vacuum collet.
see recommended solder reflow profile. Conductive
epoxy is not recommended. Hand soldering is not
recommended.
dot placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will degrade RF
performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp to avoid damage
due to thermal shock.
temperature of 280qC for 15 sec. Verify that the profile
will not expose device beyond these limits.
Allow the module to dry before testing.
Note: These devices are ESD
sensitive. The following precau-
tions are strongly recommend-
ed. Ensure that an ESD approved
carrier is used when die are trans-
ported from one destination to
another. Personal grounding is

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