BMA150-0330SB0003 BOSCH, BMA150-0330SB0003 Datasheet - Page 38

• Manufacturer Part Number: BMA150-0330SB0003
• Description: Daughter Board
• Manufacturer: BOSCH

Specifications of BMA150-0330SB0003

• Silicon Manufacturer: Bosch
• Application Sub Type: Accelerometer - Three-Axis
• Kit Application Type: Sensing - Motion / Vibration / Shock
• Silicon Core Number: BMA150
• Kit Contents: Board

5. Package
5.1 Outline dimensions
The BMA150 is packaged in a 3mm x 3mm x 0.9mm LGA package following JEDEC MO-229.
Basic outline geometry is based on:
Please note: In addition to the LGA package, the BMA150 is also available in a QFN-type
package, codenamed “SMB380”. The QFN and LGA packages are 100% pin compatible.
Figure 17: Top, bottom and side views of the 3mm x 3mm x 0.9mm LGA package
Rev. 1.5
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
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outline drawing (dimensions in mm)
Mold package footprint
Height
No. of leads
Lead pitch
Triaxial, digital acceleration sensor
3mm x 3mm (tolerance ±0.1mm)
0.9mm
12
- 8 used for electrical connection
- 2 not used / reserved
- 2 additional metal features on front edges without
samples)
0.5mm
electrical functionality (not available on first engineering
Data sheet
BMA150
Page 38
Bosch Sensortec
30 May 2008