PCF8577CTD NXP Semiconductors, PCF8577CTD Datasheet - Page 19

LCD Drivers 64 SGMT LCD SGMT DRV

PCF8577CTD

Manufacturer Part Number
PCF8577CTD
Description
LCD Drivers 64 SGMT LCD SGMT DRV
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8577CTD

Number Of Segments
32
Maximum Clock Frequency
100 KHz
Operating Supply Voltage
2.5 V to 6 V
Maximum Power Dissipation
500 mW
Package / Case
VSO-40
Maximum Supply Current
125 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PCF8577CT/3,112
Philips Semiconductors
13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
1998 Jul 30
handbook, full pagewidth
LCD direct/duplex driver with
I
Chip area = 4.62 mm
Thickness = 381 25 m.
n-substrate (back) connected to V
Bonding pad dimensions = 110 m
2
C-bus interface
2
.
DD
2.31
.
mm
110 m.
handbook, halfpage
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
10
12
13
14
15
16
11
5
6
7
8
9
Fig.18 Bonding pad locations.
17
Fig.19 Reference marks.
4
18
3
x
19
2
PCF8577C
0
20
2 mm
1
y
0
19
40
21
39
22
38
23
MBE924
37
24
MGA726
36
35
34
33
32
31
30
29
28
27
26
25
V DD
A2/BP2
BP1
S1
S2
S3
S4
S5
S6
S7
Product specification
PCF8577C

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