HFBR-5963AL Avago Technologies US Inc., HFBR-5963AL Datasheet - Page 4

• Manufacturer Part Number: HFBR-5963AL
• Description: Fiber Optic Transmitters, Receivers, Transceivers OC3/FE 2X5 LC SD LVT TL EXTD TEMP
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-5963AL

• Function: Transceivers for ATM, FDDI, Fast Ethernet and SONET OC-3/SDH STM-1 with LC connector.
• Product: Transceiver
• Data Rate: 125 Mbps, 155 Mbps
• Wavelength: 1300 nm
• Maximum Rise Time: 3 ns, 2.2 ns
• Maximum Fall Time: 3 ns, 2.2 ns
• Pulse Width Distortion: 0.4 ns, 0.3 ns
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 2.97 V to 3.63 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: DIP-10 with Connector
• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155.52MBd
• Optical Rise Time: 3/2.2ns
• Optical Fall Time: 3/2.2ns
• Jitter: 0.4/0.3ns
• Operating Temperature Classification: Industrial
• Peak Wavelength: 1308/1380nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 2.97V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.63V
• Output Current: 50mA
• Operating Temp Range: -40C to 85C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• For Use With: Multimode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Handling Precautions
Avago Technologies recommends that normal static pre-
cautions be taken in the handling and assembly of these
transceivers to prevent damage which may be induced
by electrostatic discharge (ESD).
The HFBR-5963L series of transceivers meet MIL-STD-
883C Method 3015.4 Class 2 products.
Care should be used to avoid shorting the receiver data
or signal detect outputs directly to ground without
proper current limiting impedance.
Solder and Wash Process Compatibility
The transceivers are delivered with protective process
plugs inserted into the LC receptacle.
This process plug protects the optical subassemblies dur-
ing wave solder and aqueous wash processing and acts
as a dust cover during shipping.
These transceivers are compatible with either industry
standard wave or hand solder processes.
Figure 3. Recommended Decoupling and Termination Circuits

T X
R X
Notes:
C1 = C2 = C3 = 10 nF or 100 nF
* Loading of R1 is optional.
TRANSCEIVER INPUTS
10
1
TERMINATE AT
2
9
3
8
130 Ω
4
100 Ω
7
5
6
130 Ω
C2
C1
Z = 50 Ω
Z = 50 Ω
1 µH
1 µH
V CC (+3.3 V)
C3
Z = 50 Ω
Z = 50 Ω
Z = 50 Ω
10 µF
Shipping Container
The transceiver is packaged in a shipping container de-
signed to protect it from mechanical and ESD damage
during shipment or storage.
Board Layout - Decoupling Circuit,
Ground Planes and Termination
Circuits
It is important to take care in the layout of your circuit
board to achieve optimum performance from these
transceivers. Figure 3 provides a good example of a
schematic for a power supply decoupling circuit that
works well with these parts. It is further recommended
that a contiguous ground plane be provided in the
circuit board directly under the transceiver to provide
a low inductance ground for signal return current. This
recommendation is in keeping with good high frequency
board layout practices. Figures 3 and 4 show two recom-
mended termination schemes.
130 Ω
R1*
4.7KΩ
V CC (+3.3 V)
DEVICE INPUTS
TERMINATE AT
100 Ω
130 Ω
TD-
TD+
RD+
RD-
SD
LVTTL
V CC (+3.3 V)
PHY DEVICE
LVPECL
LVPECL
V CC (+3.3 V)