HSDL-3021-021 Avago Technologies US Inc., HSDL-3021-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3021-021
• Description: Infrared Transceivers FIR + RC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3021-021

• Wavelength: 885 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 4 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above
liquidus point, 217 C
Peak Temperature
Time within 5 C of actual
Peak Temperature
Time 25 C to Peak Temperature
The reflow profile is a straight-line
representation of a nominal
temperature profile for a convective
reflow solder process. The
temperature profile is divided into
four process zones, each with
different DT/Dtime temperature
change rates, or duration. The DT/
Dtime rates, or duration, are
detailed in the above table. The
temperatures are measured at the
component to printed circuit board
connections.
In process zone P1, the PC board
and HSDL-3021 pins are heated to a
temperature of 150 C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 3 C per second to allow
for even heating of both the PC
board and HSDL-3021 pins.
12
255
230
217
200
180
150
120
80
25
0
HEAT
R1
UP
P1
50
SOLDER PASTE DRY
R2
100
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
P2
t-TIME (SECONDS)
Process zone P2 should be of
sufficient time duration (100 to 180
seconds) to dry the solder paste.
The temperature is raised to a level
just below the liquidus point of the
solder.
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised above
the liquidus point of solder to 260 C
(500 F) for optimum results. The
dwell time above the liquidus point
of solder should be between 60 and
90 seconds. This is to assure proper
coalescing of the solder paste into
liquid solder and the formation of
good solder connections. Beyond
the recommended dwell time, the
intermetallic growth within the
solder connections becomes
excessive, resulting in the formation
150
R3
60 sec.to 90 sec.
MAX. 260 C
REFLOW
SOLDER
ABOVE
200
217 C
P3
R4
DT
25 C to 150 C
150 C to 200 C
200 C to 260 C
260 C to 200 C
200 C to 25 C
>217 C
260 C
–
25 C to 260 C
DOWN
250
COOL
P4
R5
300
of weak and unreliable connections.
The temperature is then rapidly
reduced to a point below the solidus
temperature of the solder to allow
the solder within the connections to
freeze solid.
Process zone P4 is the cool down
after solder freeze. The cool down
rate, R5, from the liquidus point of
the solder to 25 C (77 F) should not
exceed 6 C per second maximum.
This limitation is necessary to allow
the PC board and HSDL-3021 pins
to change dimensions evenly,
putting minimal stresses on the
HSDL-3021.
It is recommended to perform
reflow soldering no more than
twice.
Maximum DT/DTime or Duration
3 C/s
100s to 180s
3 C/s
-6 C/s
-6 C/s
60s to 90s
–
20s to 40s
8 mins