ASDL-3007-021 Avago Technologies US Inc., ASDL-3007-021 Datasheet - Page 13

• Manufacturer Part Number: ASDL-3007-021
• Description: Infrared Transceivers SIR+RC transceiver
• Manufacturer: Avago Technologies US Inc.

Specifications of ASDL-3007-021

• Wavelength: 885 nm, 875 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 19 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 5.5 V
• Maximum Forward Current: 32 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7 mm x 2.8 mm x 1.6 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder
process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change
rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at
the component to printed circuit board connections.
In process zone P1, the PC board and ASDL-3007 pins are heated to a temperature of 150°C to activate the flux in the
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC
board and ASDL-3007 pins.
Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder.
Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of
solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60
and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze
solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and ASDL-
3007 pins to change dimensions evenly, putting minimal stresses on the ASDL-3007.
It is recommended to perform reflow soldering no more than twice.
1
150
120
255
230
217
200
180
25
80
Process Zones
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point , 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
0
R1
HEAT
P1
UP
50
R2
Symbol
P1, R1
P2, R2
P, R
P, R4
P4, R5
SOLDER PASTE DRY
100
P2
150
DT
25°C to 150°C
150°C to 200°C
200°C to 260°C
260°C to 200°C
200°C to 25°C
> 217°C
260°C
-
25°C to 260°C
R3
60 sec to 90 sec
MAX 260 ° C
Above 217 ° C
200
REFLOW
SOLDER
P3
Maximum DT/Dtime or Duration
°C/s
100s to 180s
°C/s
-6°C/s
-6°C/s
60s to 90s
-
20s to 40s
8mins
R4
COOL DOWN
250
P4
R5
t-TIME
(SECONDS)
300