08055E104MAT2A AVX Corporation, 08055E104MAT2A Datasheet - Page 9

• Manufacturer Part Number: 08055E104MAT2A
• Description: Capacitor, Ceramic; 0.1uF; Chip; Case 0805; +/-20%; 50WVDC; SMD; Z5U; 100000 Mohm; 0.05I
• Manufacturer: AVX Corporation
• Series: 0805r

Specifications of 08055E104MAT2A

• Tolerance (+ Or -): 20%
• Voltage: 50VDC
• Temp Coeff (dielectric): Z5U
• Operating Temp Range: 10C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 2.01mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 1.3mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: .1uF
• Package / Case: 0805
• Brand/series: AVX
• Case Code: 0805
• Case Size: 0805
• Dielectric Strength: No breakdown or visual defects
• Insulation Resistance: 100000 Megohms
• Length: 0.079 in. ± 0.008 in.
• Material, Element: Ceramic
• Package Type: 0805
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Tolerance: ±20 %
• Voltage, Rating: 50 VDC
• Width: 0.049 in. ± 0.008 in.
• Voltage Rating: 50 Volts
• Operating Temperature Range: + 10 C to + 85 C
• Temperature Coefficient / Code: Z5U
• Product: General Type MLCCs
• Dimensions: 0.049 in W x 0.079 in L x 0.930 mm H
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Compliant

RESISTANCE TO VIBRATION
General Specifications
Mechanical
Specification
Measuring Conditions
Specification
Measuring Conditions
SOLDERABILITY
24
END TERMINATION ADHERENCE
Specification
Measuring Conditions
No evidence of peeling of end terminal
After soldering devices to circuit board apply 5N
(0.51kg f) for 10 ± 1 seconds, please refer to Figure 1.
fresh solder
Dip device in eutectic solder at 230 ± 5°C for
2 ± .5 seconds
Appearance:
No visual defects
Capacitance
Within specified tolerance
Q, Tan Delta
To meet initial requirement
Insulation Resistance
C0G (NP0), X7R
Z5U, Y5V
Vibration Frequency
10-2000 Hz
Maximum Acceleration
20G
Swing Width
1.5mm
Test Time
X, Y, Z axis for 2 hours each, total 6 hours of test
TEST BOARD
95% of each termination end should be covered with
5N FORCE
Initial Value x 0.1
DEVICE UNDER TEST
Initial Value x 0.3
Terminal Adhesion
Figure 1.
BEND STRENGTH
RESISTANCE TO SOLDER HEAT
Specification
Measuring Conditions
Specification
Measuring Conditions
Deflection
Appearance:
No visual defects
Capacitance Variation
Insulation Resistance
Please refer to Figure 2
Deflection:
2mm
Test Time:
30 seconds
Appearance:
No serious defects, <25% leaching of either end
terminal
Capacitance Variation
Q, Tan Delta
To meet initial requirement
Insulation Resistance
To meet initial requirement
Dielectric Strength
No problem observed
Dip device in eutectic solder at 260°C, for 1 minute.
Store at room temperature for 48 hours (24 hours for
C0G (NP0)) before measuring electrical parameters.
Part sizes larger than 3.20mm x 2.49mm are reheated
at 150°C for 30 ±5 seconds before performing test.
C0G (NP0): ± 2.5% or ± 2.5pF, whichever is greater
C0G (NP0): ± 5% or ± .5pF, whichever is larger
C0G (NP0): ≥ Initial Value x 0.3
2mm
X7R: ≤ ± 7.5%
Z5U: ≤ ± 20%
X7R: ≤ ± 12%
Z5U: ≤ ± 30%
X7R: ≥ Initial Value x 0.3
Z5U: ≥ Initial Value x 0.1
Y5V: ≤ ± 20%
Y5V: ≤ ± 30%
Y5V: ≥ Initial Value x 0.1
45mm
Figure 2. Bend Strength
Speed = 1mm/sec
45mm
R340mm
Supports