EMIF04-MMC02F2 STMicroelectronics, EMIF04-MMC02F2 Datasheet
EMIF04-MMC02F2
Specifications of EMIF04-MMC02F2
Available stocks
Related parts for EMIF04-MMC02F2
EMIF04-MMC02F2 Summary of contents
Page 1
... MultiMediaCard port. The EMIF04 Flip Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges kV. April 2008 EMIF04-MMC02F2 Flip Chip 11 bumps Figure 1. Pin layout (bump side ...
Page 2
... Input capacitance per line line Symbol line Tolerance ± Tolerance ± Tolerance ± 2/8 amb Parameter = 25 °C) amb Parameters RM Test conditions = 3 V EMIF04-MMC02F2 = 25 °C) Value 70 125 - -55 to +150 Min Typ Max 6 0.1 0 Unit mW °C °C °C Unit V µA pF Ω kΩ kΩ ...
Page 3
... EMIF04-MMC02F2 Figure 3. S21 (dB) attenuation measurement and Aplac simulation EMIF04-MMC02F2: Aplac vs measurement (C3/C1 line) 0. 5.00 - 10.00 Measurement - 15.00 - 20.00 - 25.00 - 30. 35.00 - 40. 45.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz Figure 5. ESD response to IEC 61000-4-2 (+15kV contact discharge) on one input (Vin) and one output (Vout) ...
Page 4
... Lbump Rbump Lbump C33 C22 bulk bulk Cbump Rbump Cbump Rbump Rbump Lbump D33 + bulk Cbump Rbump EMIF04-MMC02F2 R10 MODEL = demif04 Model demif04 Model demif04 gnd IBV = 1m IBV = 1m CJO = Cz CJO = Cz_gnd M = 0.3333 M = 0.3333 RS_gnd 100n TT = 100n Device aplacvar R1 50.053 aplacvar R2 50.053 aplacvar R3 50 ...
Page 5
... EMIF04-MMC02F2 3 Ordering information scheme Figure 10. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF letters = application 2 digits = version Package F = Flip Chip Lead-free, pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...
Page 6
... AN 1751: “EMI filters: Recomendations and measurements” 6/8 Figure 13. Marking Dot identifying Pin A1 location 0.73 ± 0.05 User direction of unreeling All dimensions in mm Marking Package FH Flip Chip EMIF04-MMC02F2 Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week Ø 1.5 ± 0.1 4 ± ...
Page 7
... EMIF04-MMC02F2 6 Revision history Table 4. Document revision history Date Revision 14-Oct-2004 06-Apr-2005 25-Aug-2005 28-Apr-2008 1 First issue 2 Minor layout update. No content change. 3 Reformatted to current standard, Aplac model updated in section 2. Updated ECOPACK statement. Updated 4 14. Reformatted to current standards. Revision history Changes Figure 10, Figure 11 and ...
Page 8
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF04-MMC02F2 ...