EMIF04-1502M8 STMicroelectronics, EMIF04-1502M8 Datasheet
EMIF04-1502M8
Specifications of EMIF04-1502M8
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EMIF04-1502M8 Summary of contents
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... Computers and printers ■ Communication systems ■ MCU boards Description The EMIF04-1502M8 is a 4-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes an ESD protection circuitry, which prevents damage to the application when subjected to ESD surges the input pins ...
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... C) amb RM Test conditions = 30 mV MHz OSC Figure 4. 0.00 0.00 -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -50.00 -60.00 -60.00 -70.00 -70.00 -80.00 -80.00 -90.00 -90.00 -100.00 -100.00 100.0M 1.0G EMIF04-1502M8 Value 125 - -55 to +150 Min. Typ. Max ...
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... EMIF04-1502M8 Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output ( out Figure 7. Line capacitance versus reverse voltage applied (typical value 0.0 0.5 2 Ordering information scheme Figure 8. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms) ...
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... QFN 1.7 x 1.5 package dimensions Figure 9. Footprint 0.40 0.40 1.00 4/10 D Ref Figure 10. Marking 0.20 0.60 0.25 2.10 EMIF04-1502M8 Dimensions Millimeters MIN TYP MAX MIN A 0.50 0.55 0.60 0.20 A1 0.00 0.02 0.05 0.00 b 0.15 0.18 0.25 0.06 D 1.70 D2 0.9 1.00 1.10 0. ...
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... EMIF04-1502M8 Figure 11. Tape and reel specification Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark used for this purpose. 2.0+/-0.05 2.0+/-0.05 4 ...
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... Figure 13. Recommended stencil window position 400 µm 160 µm 6/ ≥ ---- - = 1.5 T × ≥ --------------------------- - = 0. µm 5 µm 15 µm 190 µm 15 µm 0.40 200 µm 1000 µm 50 µm 680 µm 50 µm 160 µm EMIF04-1502M8 0.40 0.20 0.60 0.25 2.10 1.00 Footprint Stencil window Footprint ...
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... EMIF04-1502M8 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 3°C/s max 3°C/s max 150 sec 90 to 150 sec EMIF04-1502M8 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec 90 sec max ...
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... EMIF04-1502M8 5 Ordering information Table 4. Ordering information Order code EMIF04-1502M8 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 12-Dec-2005 03-Jul-2006 01-Feb-2007 26-Feb-2007 04-Feb-2008 05-Jan-2009 Marking Package (1) G4 Micro QFN Revision 1 Initial release. Reformatted to current standard. Changed Figure 1 to show 2 improved results ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF04-1502M8 ...