EMIF04-VID01F2 STMicroelectronics, EMIF04-VID01F2 Datasheet

IC EMI FILTER 4LINE ESD FLIPCHIP

EMIF04-VID01F2

Manufacturer Part Number
EMIF04-VID01F2
Description
IC EMI FILTER 4LINE ESD FLIPCHIP
Manufacturer
STMicroelectronics
Series
IPAD™r
Datasheet

Specifications of EMIF04-VID01F2

Filter Type
Signal Line
Voltage - Rated
3V
Mounting Type
Surface Mount
Termination Style
Surface Mount (SMD,SMT)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Inductance
-
Other names
497-4614-2

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Part Number:
EMIF04-VID01F2
Manufacturer:
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Quantity:
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Part Number:
EMIF04-VID01F2
Manufacturer:
ST
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MAIN APPLICATION
Where EMI filtering in ESD sensitive equipment is
required:
DESCRIPTION
The EMIF04-VID01F2 is a 4 lines highly integrated
array designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic interferenc-
es.
The EMIF04-VID01F2 Flip-Chip packaging means
the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on input pins
MIL STD 883E - Method 3015-6 Class 3
TM: IPAD is a trademark of STMicroelectronics.
February 2005
LCD and camera for mobile phones
Computers and printers
Communication systems
MCU board
High efficiency EMI filtering (-40db @ 900MHz)
Low line capacitance suitable for high speed
data bus
Low serial resistance for camera impedance
adaptation
Lead free package
Optimized PCB space consuming:
1.92mm x 1.29mm
Very thin package: 0.65 mm
High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging
Reduce compnents counts and BOM
IPAD™
®
15kV (air discharge)
8kV (contact discharge)
4 LINES LOW CAPACITANCE EMI FILTER
REV. 1
Figure 1: Pin Configuration (ball side)
Table 1: Order Code
Figure 2: Configuration
Input
EMIF04-VID01F2
Part Number
AND ESD PROTECTION
O4
I4
6
R = 100
C
EMIF04-VID01F2
Gnd
LINE
5
(10 Bumps)
O3
I3
4
= 16pF typ. @ 3V
Flip-Chip
R
O2
I2
3
Gnd
2
O1
I1
Marking
1
GU
A
B
C
Output
1/6

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EMIF04-VID01F2 Summary of contents

Page 1

... Computers and printers ■ Communication systems ■ MCU board DESCRIPTION The EMIF04-VID01F2 lines highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferenc- es. The EMIF04-VID01F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection ...

Page 2

... EMIF04-VID01F2 Table 2: Absolute Ratings (limiting values) Symbol Parameter and test conditions T Maximum junction temperature j T Operating temperature range op T Storage temperature range stg Table 3: Electrical Characteristics (T Symbol Parameter V Breakdown voltage BR I Leakage current @ Stand-off voltage RM R Series resistance between Input & ...

Page 3

... Figure 4: Analog crosstalk measurement 0 dB -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 100M 1G Figure 6: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and on one output (Vout) Input 10V/d Output 10V/d 2.0 2.0 2.5 2.5 3.0 3.0 EMIF04-VID01F2 100k 1M 10M 100M f/Hz 200ns/d 1G 3/6 ...

Page 4

... EMIF04-VID01F2 Figure 8: Ordering Information Scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF letters = application 2 digits = version Package F2 = Leadfree Flip-Chip 500µm, Bump = 315µ Leadfree Pitch = 500µm, Bump = 315µm Figure 9: FLIP-CHIP Package Mechanical Data 500µm ± 50 250µ ...

Page 5

... AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” Table 5: Revision History Date Revision 15-Feb-2005 4 +/- 0.1 User direction of unreeling Package Weight Flip-Chip 3.6 mg Description of Changes 1 First issue. EMIF04-VID01F2 Ø 1.5 +/- 0.1 4 +/- 0.1 Base qty Delivery mode 5000 Tape & reel 7” 5/6 ...

Page 6

... EMIF04-VID01F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

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