IP4064CX8/LF /T3 NXP Semiconductors, IP4064CX8/LF /T3 Datasheet - Page 8

• Manufacturer Part Number: IP4064CX8/LF /T3
• Description: Multimedia Misc INTEGRATED ESD
• Manufacturer: NXP Semiconductors
• Type: Integrated SIM Card Passive Filter Arrayr

Specifications of IP4064CX8/LF /T3

• Mounting Style: Surface Mount
• Termination: Flat Style
• Product Height (mm): 0.7mm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Package / Case: WLCSP
• Lead Free Status / RoHS Status: Compliant
• Other names: IP4064CX8/LF,135

NXP Semiconductors
Fig 9. Package outline IP4364CX8/LF (WLCSP8)
IP4064CX8LF_IP4364CX8LF_1
Product data sheet
WLCSP8: wafer level chip-size package; 8 bumps; 1.16 x 1.16 x 0.66 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
IP4364CX8/LF
VERSION
OUTLINE
max
0.66
A
0.22
0.18
A
1
bump A1
index area
0.44
0.38
A
2
IEC
0.31
0.21
C
B
A
b
1.21
1.11
1
D
1.21
1.11
e
JEDEC
E
e
D
2
1
REFERENCES
0.4
e
Rev. 01 — 12 November 2007
0.8
e
Integrated SIM card passive filter array with ESD protection
1
IP4064CX8/LF; IP4364CX8/LF
b
3
0
JEITA
0.8
e
2
scale
0.25
0.005
B
e
v
v
0.5 mm
e
A
E
2
M
0.02
y
C
A
B
A
A
2
A
detail X
1
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
07-05-09
07-05-25
IP4364CX8/LF
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