6-531396-0 TE Connectivity, 6-531396-0 Datasheet - Page 94

• Manufacturer Part Number: 6-531396-0
• Description: CONN ZIF II 100 C/L 65 POS R/A
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 6-531396-0

• Number Of Contacts: 130POS
• Body Orientation: Right Angle
• Contact Plating: Nickel
• Contact Material: Phosphor Bronze
• Termination Method: Solder
• Mounting Style: Through Hole
• Pitch (mm): 2.54mm
• Housing Material: Polyester
• Product Type: Connector
• Pcb Mounting Orientation: Right Angle
• Termination Method To Pc Board: Through Hole - Solder
• Number Of Dual Positions: 65
• Housing Style: Closed End/Open End
• Pcb Mount Alignment: Without
• Pcb Mount Retention: With
• Zif Actuator Style: Rotary Cam ZIF
• Bend Side: Right
• Qty./tray: 25
• Boardlock: With
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 5.08 [0.200]
• Pcb Mount Retention Type: Mounting Ears
• Post Plating: Matte Tin
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Underplate Material: Nickel
• Ul Flammability Rating: UL 94V-0
• Card Retention: With
• Card Retention Type: Rotary Cam ZIF, With Board Lock
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL
• Operating Temperature (°c [°f]): -55 – +105 [-67 – +221]
• Applies To: Printed Circuit Board
• Accepts Card Thickness (mm [in]): 1.37 – 1.78 [0.054 – 0.070]
• Lead Free Status / RoHS Status: Compliant

94
AMP ACTION PIN
Press-Fit Contacts
PC Board Thickness
ACTION PIN contacts are
designed for use in a variety of
PC board thicknesses. However,
certain ACTION PIN contacts
are to be used in specific ranges
of board thicknesses. To
promote optimum performance,
the recommended board thick-
nesses provided with the con-
nector being used must be
followed.
ACTION PIN Contact/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Connector
Linear ZIF
Type
Material Thickness
ACTION PIN
Contact
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
.025
0.64
Card Edge Connectors
(Solder Type, Board-to-Board)
Linear ZIF Connectors
Drilled Hole
Diameter
.0453
1.151
±.001
±0.03
ACTION PIN contacts provide a reliable press-fit connection.
Localized pressure in the interface area entails oxide
break-through and helps prevent corrosion in the harshest
environments to provide a reliable connection virtually every
time. Also, radial and axial distortion are controlled to meet
today’s standards for multilayer board applications.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Copper *
.001-.003
0.03-0.08
Plating Thicknesses
(Continued)
Tin-Lead
.0003
0.008
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Min.
Through-Hole
Diameter
.037-.043
0.94-1.09
Plated
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Specified
Average
Radial Hole Distortion
Not
Annular Ring (See Note)
Drilled Hole
Copper Thickness
Tin-Lead Thickness
Plated Through-Hole
Maximum
Specified
Not