1981568-1 TE Connectivity, 1981568-1 Datasheet - Page 60

• Manufacturer Part Number: 1981568-1
• Description: REC TYPE B ASSY (AU) MICRO USB
• Manufacturer: TE Connectivity
• Series: DisplayPort Receptacles and Cable Assembliesr

Specifications of 1981568-1

• Number Of Contacts: 5POS
• Body Orientation: Right Angle
• Contact Material: Copper Alloy
• Operating Temp Range: -55C to 85C
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 30VAC
• Product Height (mm): 3mm
• Number Of Ports: 1Port
• Gender: RCP
• Mounting Style: Surface Mount
• Contact Plating: Gold Over Nickel
• Housing Material: Thermoplastic
• Product: Micro USB Type B Connectors
• Standard: USB
• Pitch: 0.65 mm
• Current Rating: 1 A
• Termination Style: Solder Pad
• Connector Type: Micro USB Type B Receptacle
• Color: Black
• Features: Without Locking Feature
• Flammability Rating: UL 94 V-0
• Insulation Resistance: 100 MOhms
• Mounting Angle: Right
• Number Of Positions / Contacts: 5
• Operating Temperature Range: 0 C to + 50 C
• Voltage Rating: 30 VAC
• Size: Micro
• Orientation: Right Angle
• Mount Location: Top
• Termination Method: Surface Mount
• Locking Feature: Without
• Led: Without
• Panel Ground: Without
• Pcb Mount Retention Type: SMT Hold Down
• Shell Plating: Reflowed Tin over Nickel
• Assembly Process Feature: Without Pick and Place Cover
• Locating Post(s): Without
• Number Of Positions: 5
• Contact Termination Type: Surface Mount
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Housing Color: Black
• Industry Standard: USB 2.0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Usb-if Test Id Number (tid): 60001336
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.00 [0.039]
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

58
Products for Mobile Equipment
Antenna Products
Antenna Manufacturing Capabilities
Three Key Technologies
MID (Molded Interconnect Device) Antennas
In 2000, Tyco Electronics acquired Molded Interconnect Device, LLC (MID). Now part of Tyco
Electronics Antenna Products, MID is headquartered in Rochester, NY and prides itself in being the
world’s leader in utilizing its technology to make everyday products better. With over 500 million
parts in service, our products are being utilized in applications ranging from joysticks to cell phones
as well as minivans to airplanes. In its most basic form, MID technology can be defined as any
product that results in selectively plated plastic parts. This technology results in outstanding repeat-
ability, which is ultimately suitable for the design and production of complex shaped antennas.
Stamped Metal and Overmolded
Tyco Electronics Antenna products has developed a line of low profile, high performance
Stamped Metal embedded antenna solutions for single-, dual-, tri-and quad-band applications.
Tyco Electronics Stamped Metal antennas offer OEMs, a low cost and highly repeatable manu-
facturing solution, in a number of standard “of the shelf” and customized antenna designs. Our
stamped embedded antennas address the needs of a variety of applications from 400 MHz to
5 GHz such as; mobile phones (AMPS, TDMA, CDMA, WCDMA, PCS, DCS and GSM), cordless
telephones, personal digital assistants (PDA), laptop computers, global positioning system (GPS)
devices and wireless networking (Bluetooth, 802.11 and ISM).
All specifications subject to change. Consult Tyco Electronics for latest specifications.
MID Two Shot Antennas
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Stamped Antennas
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Design flexibility for 3D patterning
Fewest manufacturing steps and processes
Repeatability of manufacturing process
Ability to integrate multiple functions
Flexible manufacturing capacity
Manageability of demand increases
Simple low cost standardized interconnect utilized
Best utilization of the 3D space that is available
Tightest tolerances for pattern registration
Stamped and heatstaked
Stamped and overmolded
Pure stampings
Typically the lowest cost antenna technology
when considering the interconnect cost as well
Interconnect can be designed in (contacts)
Production die is high volume capable
Hand assembly stations can be added for volume
upswings
Catalog 1654270-2
Revised 8-2007