1981568-1 TE Connectivity, 1981568-1 Datasheet - Page 77

• Manufacturer Part Number: 1981568-1
• Description: REC TYPE B ASSY (AU) MICRO USB
• Manufacturer: TE Connectivity
• Series: DisplayPort Receptacles and Cable Assembliesr

Specifications of 1981568-1

• Number Of Contacts: 5POS
• Body Orientation: Right Angle
• Contact Material: Copper Alloy
• Operating Temp Range: -55C to 85C
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 30VAC
• Product Height (mm): 3mm
• Number Of Ports: 1Port
• Gender: RCP
• Mounting Style: Surface Mount
• Contact Plating: Gold Over Nickel
• Housing Material: Thermoplastic
• Product: Micro USB Type B Connectors
• Standard: USB
• Pitch: 0.65 mm
• Current Rating: 1 A
• Termination Style: Solder Pad
• Connector Type: Micro USB Type B Receptacle
• Color: Black
• Features: Without Locking Feature
• Flammability Rating: UL 94 V-0
• Insulation Resistance: 100 MOhms
• Mounting Angle: Right
• Number Of Positions / Contacts: 5
• Operating Temperature Range: 0 C to + 50 C
• Voltage Rating: 30 VAC
• Size: Micro
• Orientation: Right Angle
• Mount Location: Top
• Termination Method: Surface Mount
• Locking Feature: Without
• Led: Without
• Panel Ground: Without
• Pcb Mount Retention Type: SMT Hold Down
• Shell Plating: Reflowed Tin over Nickel
• Assembly Process Feature: Without Pick and Place Cover
• Locating Post(s): Without
• Number Of Positions: 5
• Contact Termination Type: Surface Mount
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Housing Color: Black
• Industry Standard: USB 2.0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Usb-if Test Id Number (tid): 60001336
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.00 [0.039]
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

Mini SIM
Card Packaging
Tyco Electronics propose
a new Packaging for the
3
The leadframe is over moulded
with a plastic package at
dimension close to the final
Mini SIM card body.
This technology allows our
customers to work directly
on advanced product and
use their standard available
reel-to-reel equipments.
rd
Generation of SIM Cards
Products for Mobile Equipment
Mechatronic Center Niefern
Mini SIM Card Packaging
Key Features
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■
Produced with the Standard
Tyco Electronics Technologies
■
■
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Microelectronic can be made on semi final packaging, no module out cutting and embedding
operation.
Lower risk and process time improvement.
Personalisation can be realized separately on tapes, and bring together by a final operation.
No additional card body is needed, but also possibility to plug in 1
High-speed stamping
Selective plating
Laminating
Reel-to-reel over moulding
st
or 2
nd
card body generation.
Catalog 1654270-2
Revised 8-2007
75