IP4064CX8/LF,135 NXP Semiconductors, IP4064CX8/LF,135 Datasheet - Page 11

• Manufacturer Part Number: IP4064CX8/LF,135
• Description: ESD Suppressors INTEGRATED ESD
• Manufacturer: NXP Semiconductors

Specifications of IP4064CX8/LF,135

• Mounting Style: Surface Mount
• Termination: Flat Style
• Product Height (mm): 0.7mm
• Operating Voltage: 5.5 V
• Channels: 3 Channels
• Breakdown Voltage: 6 V to 10 V
• Capacitance: 20 pF
• Termination Style: SMD/SMT
• Package / Case: WLCSP-8
• Power Dissipation Pd: 180 mW
• Operating Temperature Range: - 30 C to + 85 C
• Lead Free Status / RoHS Status: Compliant
• Other names: /T3 934058497135 IP4064CX8/LF

NXP Semiconductors
10. Abbreviations
11. Revision history
Table 7.
IP4064CX8LF_IP4364CX8LF_1
Product data sheet
Document ID
IP4064CX8LF_IP4364CX8LF_1 20071112
Revision history
9.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description” .
Cleaning can be done after reflow soldering.
Table 6.
Acronym
DUT
EMI
ESD
PCB
PCS
RFI
RoHS
SIM
Release date
Abbreviations
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
Printed-Circuit Board
Personal Communication System
Radio Frequency Interference
Restriction Of the use of certain Hazardous Substances directive
Subscriber Identity Module
Rev. 01 — 12 November 2007
Data sheet status
Product data sheet
Integrated SIM card passive filter array with ESD protection
IP4064CX8/LF; IP4364CX8/LF
Change notice
-
Supersedes
-
© NXP B.V. 2007. All rights reserved.
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