IP4252CZ12-6-TTL NXP Semiconductors, IP4252CZ12-6-TTL Datasheet - Page 4
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IP4252CZ12-6-TTL
Manufacturer Part Number
IP4252CZ12-6-TTL
Description
Manufacturer
NXP Semiconductors
Datasheet
1.IP4252CZ12-6-TTL.pdf
(18 pages)
Specifications of IP4252CZ12-6-TTL
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
85C
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
4. Limiting values
5. Thermal characteristics
IP4251_52_53_54-TTL
Objective data sheet
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 5.
[1]
Symbol
IP4251CZ8-4-TTL; IP4251CZ12-6-TTL; IP4251CZ16-8-TTL
V
IP4252CZ8-4-TTL; IP4252CZ12-6-TTL; IP4252CZ16-8-TTL
V
IP4253CZ8-4-TTL; IP4253CZ12-6-TTL; IP4253CZ16-8-TTL
V
IP4254CZ8-4-TTL; IP4254CZ12-6-TTL; IP4254CZ16-8-TTL
V
Per device
V
V
P
P
T
T
Symbol Parameter
R
stg
amb
ESD
ESD
ESD
ESD
ESD
CC
ch
tot
th(j-pcb)
Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
Device tested with 1000 pulses of ±30 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
Depends on layout details.
thermal resistance from
junction to printed-circuit board
Parameter
electrostatic discharge
voltage
electrostatic discharge
voltage
electrostatic discharge
voltage
electrostatic discharge
voltage
electrostatic discharge
voltage
supply voltage
channel power dissipation T
total power dissipation
storage temperature
ambient temperature
Limiting values
Thermal characteristics
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 January 2011
Integrated 4-, 6- and 8-channel passive filter network
T
Conditions
all pins to ground;
contact discharge
all pins to ground;
contact discharge
all pins to ground
all pins to ground
IEC 61000-4-2, level 4;
all pins to ground
amb
amb
contact discharge
air discharge
contact discharge
air discharge
contact discharge
air discharge
Conditions
2-layer printed-circuit
board
= 85 °C
= 85 °C
IP4251/52/53/54-TTL
[1]
Min
-
[1]
[1]
[2]
[2]
Min
-
-
-
-
-
-
-
-
−0.5
-
-
−55
−40
Typ
120
© NXP B.V. 2011. All rights reserved.
Max
±15
±15
±30
±30
±30
±30
±8
±15
+5.6
60
200
+150
+85
Max
-
Unit
K/W
Unit
kV
kV
kV
kV
kV
kV
kV
kV
V
mW
mW
°C
°C
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