PAC-SYSTEMCLK5520 Lattice, PAC-SYSTEMCLK5520 Datasheet - Page 44

• Manufacturer Part Number: PAC-SYSTEMCLK5520
• Description: Development Software ispCLK5520 Design Sys
• Manufacturer: Lattice

Specifications of PAC-SYSTEMCLK5520

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
Package Diagrams
48-Pin TQFP (Dimensions in Millimeters)
NOTES:
1.
2.
4.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
6.
7.
8.
3.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
ALL DIMENSIONS ARE IN MILLIMETERS.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
SECTION B-B:
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
c
0.08
SECTION B - B
3.
e
8.
M C
A
4X
PIN 1 INDICATOR
1
A -B D
b
b
b
1
N
D
D
c
1
SEE DETAIL "A"
3.
BASE METAL
LEAD FINISH
B 3.
C
0.20
SEATING PLANE
E
C A-B D
44
0.08 C
A
0.20
A2
A1
ispClock5500 Family Data Sheet
H
SYMBOL
E1
0.20 MIN.
A-B
1.00 REF.
A
A1
A2
D
D1
E
E1
L
N
e
b
b1
c
c1
DETAIL "A"
H
D
0.05
1.35
0.45
0.17
0.17
0.09
0.09
MIN.
-
D1
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
0.50 BSC
NOM.
1.40
0.60
48
0.15
0.13
0.20
-
-
0.22
GAUGE PLANE
0-7∞
L
MAX.
1.60
0.15
1.45
0.75
0.27
0.23
0.20
0.16
0.25