LFE2-50E-H-EV Lattice, LFE2-50E-H-EV Datasheet - Page 333

no-image

LFE2-50E-H-EV

Manufacturer Part Number
LFE2-50E-H-EV
Description
MCU, MPU & DSP Development Tools LatticeECP2 Eval Brd - Advanced
Manufacturer
Lattice
Datasheet

Specifications of LFE2-50E-H-EV

Processor To Be Evaluated
LatticeECP2 FPGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Pinout Information
Lattice Semiconductor
LatticeECP2/M Family Data Sheet
LFE2M100E/SE Logic Signal Connections: 900 fpBGA (Cont.)
LFE2M100E/SE
Ball Number
Ball/Pad Function
Bank
Dual Function
Differential
V18
VCCPLL
-
* Supports true LVDS. Other differential signals must be emulated with external resistors.
** These dedicated input pins can be used for GPLLs or GDLLs within the respective quadrant.
*** These sysCONFIG pins are dedicated I/O pins for configuration. The outpus are actively driven during normal device operation.
****Due to packaging bond out option, this DQS does not have all the necessary DQ pins bonded out for a full 8-bit data width.
Note: VCCIO and GND pads are used to determine the average DC current drawn by I/Os between GND/VCCIO connections, or between the
last GND/VCCIO in an I/O bank and the end of an I/O bank. The substrate pads listed in the Pin Table do not necessarily have a one to one
connection with a package ball or pin.
4-230

Related parts for LFE2-50E-H-EV