D3172MMA7361LC Freescale Semiconductor, D3172MMA7361LC Datasheet - Page 29

• Manufacturer Part Number: D3172MMA7361LC
• Description: Acceleration Sensor Development Tools XYZ-AXIS DIGITAL ACCEL D
• Manufacturer: Freescale Semiconductor

Specifications of D3172MMA7361LC

• Acceleration: 1.5 g
• Sensing Axis: Triple Axis
• Output Type: Digital
• Interface Type: I2C, SPI
• Operating Voltage: 2 V to 3.4 V
• Operating Current: 47 uA
• Sensitivity: 64 LSB/g
• For Use With/related Products: MMA7660FC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package.
With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to
design boards with a solder mask layer to avoid bridging and shorting between solder pads.
SOLDERING AND MOUNTING GUIDELINES FOR THE LGA ACCELEROMETER SENSOR TO A PC BOARD
These guideline are for soldering and mounting the LGA package inertial sensors to printed circuit boards (PCBs). The purpose
is to minimize the stress on the package after board mounting. The MMA7455L digital output accelerometer uses the Land Grid
Array (LGA) package platform. This section describes suggested methods of soldering these devices to the PC board for con-
sumer applications.
Sensors
Freescale Semiconductor
Figure 18
Figure 18. Recommended PCB Land Pattern for the 5 x 3 mm LGA Package
shows the recommended PCB land pattern for the package.
MMA7455L
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