AD5293BRUZ-50 Analog Devices Inc, AD5293BRUZ-50 Datasheet - Page 9

1024 Tap, 1% DigiPOT With SPI Interface

AD5293BRUZ-50

Manufacturer Part Number
AD5293BRUZ-50
Description
1024 Tap, 1% DigiPOT With SPI Interface
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD5293BRUZ-50

Taps
1024
Resistance (ohms)
50K
Number Of Circuits
1
Temperature Coefficient
35 ppm/°C Typical
Interface
SPI Serial
Voltage - Supply
9 V ~ 33 V, ±9 V ~ 16.5 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Resistance In Ohms
50K
Number Of Elements
1
# Of Taps
1024
Resistance (max)
50KOhm
Power Supply Requirement
Single/Dual
Interface Type
Serial (4-Wire/SPI)
Single Supply Voltage (typ)
15V
Dual Supply Voltage (typ)
±15V
Single Supply Voltage (max)
33V
Dual Supply Voltage (max)
±16.5V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
14
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Type
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD5293BRUZ-50
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ABSOLUTE MAXIMUM RATINGS
T
Table 6.
Parameter
V
V
V
V
V
Digital Input and Output Voltage to GND
EXT_CAP Voltage to GND
I
Operating Temperature Range
Maximum Junction Temperature (T
Storage Temperature Range
Reflow Soldering
Package Power Dissipation
1
2
3
A
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
Maximum continuous current.
Pulse duty factor.
DD
SS
LOGIC
DD
A
A
, I
, V
Continuous
Pulsed
Peak Temperature
Time at Peak Temperature
B
= 25°C, unless otherwise noted.
to GND
to GND
to V
, I
B
R
R
Frequency > 10 kHz
Frequency ≤ 10 kHz
, V
to GND
W
AB
AB
W
SS
= 20 kΩ
= 50 kΩ, 100 kΩ
1
to GND
J
max)
Rating
−0.3 V to +35 V
+0.3 V to −25 V
−0.3 V to +7 V
35 V
V
−0.3 V to V
−0.3 V to +7 V
±3 mA
±2 mA
MCC
MCC
−40°C to +105°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(T
SS
J
− 0.3 V, V
max − T
2
2
/√d
/d
3
3
LOGIC
A
DD
)/θ
+ 0.3 V
JA
+0.3 V
Rev. D | Page 9 of 24
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
14-Lead TSSOP
1
ESD CAUTION
JEDEC 2S2P test board, still air (from 0 m/sec to 1 m/sec of air flow).
JA
is specified for the worst-case conditions, that is, a device
θ
93
JA
1
θ
20
JC
AD5293
Unit
°C/W

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