AD9516-2BCPZ-REEL7 Analog Devices Inc, AD9516-2BCPZ-REEL7 Datasheet - Page 16

• Manufacturer Part Number: AD9516-2BCPZ-REEL7
• Description: IC,Ten Distributed-Output Clock Driver,LLCC,64PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Type: Clock Generator, Fanout Distributionr

Specifications of AD9516-2BCPZ-REEL7

• Pll: Yes
• Input: Clock
• Output: CMOS, LVDS, LVPECL
• Number Of Circuits: 1
• Ratio - Input:output: 1:14
• Differential - Input:output: Yes/Yes
• Frequency - Max: 2.33GHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFCSP
• Frequency-max: 2.33GHz
• Function: Clock Generator
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: LFCSP EP
• Pin Count: 64
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9516-2/PCBZ - BOARD EVAL FOR AD9516-2 2.2GHZ
• Lead Free Status / Rohs Status: Compliant

AD9516-2
ABSOLUTE MAXIMUM RATINGS
Table 18.
Parameter
VS, VS_LVPECL to GND
VCP to GND
REFIN, REFIN to GND
REFIN to REFIN
RSET to GND
CPRSET to GND
CLK, CLK to GND
CLK to CLK
SCLK, SDIO, SDO, CS to GND
OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
SYNC to GND
REFMON, STATUS, LD to GND
Junction Temperature
Storage Temperature Range
Lead Temperature (10 sec)
1
See Table 19 for θ
OUT3, OUT3, OUT4, OUT4, OUT5, OUT5,
OUT6, OUT6, OUT7, OUT7, OUT8, OUT8,
OUT9, OUT9 to GND
JA
.
1
Rating
−0.3 V to +3.6 V
−0.3 V to+5.8 V
−0.3 V to V
−3.3 V to +3.3 V
−0.3 V to V
−0.3 V to V
−0.3 V to V
−1.2 V to +1.2 V
−0.3 V to V
−0.3 V to V
−0.3 V to V
−0.3 V to V
150°C
−65°C to +150°C
300°C
S
S
S
S
S
S
S
S
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. A | Page 16 of 80
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 19.
Package Type
64-Lead LFCSP
1
ESD CAUTION
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-2
1
θ
24
JA
Unit
°C/W