ADC0808S250/DB NXP Semiconductors, ADC0808S250/DB Datasheet - Page 17

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ADC0808S250/DB

Manufacturer Part Number
ADC0808S250/DB
Description
ADC0808S250 Demo Board
Manufacturer
NXP Semiconductors
Series
-r
Datasheets

Specifications of ADC0808S250/DB

Design Resources
ADC0808S Demo Brd PCB Files
Number Of Adc's
1
Number Of Bits
8
Sampling Rate (per Second)
250M
Data Interface
Parallel
Input Range
2 Vpp
Power (typ) @ Conditions
-
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
ADC0808S250
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
NXP Semiconductors
13. Package outline
Fig 12. Package outline SOT545-2 (HTQFP48)
ADC0808S125_ADC0808S250_3
Product data sheet
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
E h
OUTLINE
SOT545-2
max.
1.2
A
y
48
37
0.15
0.05
A 1
36
1
e
1.05
0.95
A 2
exposed die pad side
pin 1 index
0.25
A 3
IEC
b
p
0.27
0.17
b p
H
D h
D
D
w
0.20
0.09
c
M
D
MS-026
7.1
6.9
JEDEC
(1)
D h
4.6
4.4
REFERENCES
Z D
Rev. 03 — 24 February 2009
12
25
0
E
7.1
6.9
13
B
24
(1)
X
Z E
E h
4.6
4.4
JEITA
b
scale
e
2.5
w
p
v
v
M
0.5
M
M
e
c
E
A
A
B
9.1
8.9
H D
H
E
Single 8-bit ADC, up to 125 MHz or 250 MHz
5 mm
H E
9.1
8.9
A
A
L
1
ADC0808S125/250
2
A
0.75
0.45
1
L p
PROJECTION
0.2
EUROPEAN
v
detail X
0.08 0.08
w
y
© NXP B.V. 2009. All rights reserved.
Z D
0.9
0.6
ISSUE DATE
L
(1)
L
03-04-07
04-01-29
p
Z E
0.9
0.6
SOT545-2
(1)
(A )
3
7
0
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