ADSP-21261SKBCZ150 Analog Devices Inc, ADSP-21261SKBCZ150 Datasheet - Page 2

150 MHz, 32Bit DSP Processor

ADSP-21261SKBCZ150

Manufacturer Part Number
ADSP-21261SKBCZ150
Description
150 MHz, 32Bit DSP Processor
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Fixed/Floating Pointr

Specifications of ADSP-21261SKBCZ150

Interface
DAI, SPI
Clock Rate
150MHz
Non-volatile Memory
ROM (384 kB)
On-chip Ram
128kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
136-CSPBGA
Device Core Size
32/40Bit
Architecture
Super Harvard
Format
Floating Point
Clock Freq (max)
150MHz
Mips
150
Device Input Clock Speed
150MHz
Ram Size
128KB
Program Memory Size
384KB
Operating Supply Voltage (typ)
1.2/3.3V
Operating Supply Voltage (min)
1.14/3.13V
Operating Supply Voltage (max)
1.26/3.47V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
136
Package Type
CSPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21261SKBCZ150
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
ADSP-21261SKBCZ150
Manufacturer:
AD
Quantity:
125
Part Number:
ADSP-21261SKBCZ150
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADSP-21261/ADSP-21262/ADSP-21266
TABLE OF CONTENTS
Summary ............................................................... 1
Table of Contents ..................................................... 2
Revision History ...................................................... 2
General Description ................................................. 3
Pin Function Descriptions ....................................... 10
Product Specifications ............................................. 14
REVISION HISTORY
7/09—Rev. E to Rev. F
Corrected all outstanding document errata.
Added temperature grade. See
Clarified VCO operations. See
Voltage Controlled Oscillator .................................... 16
Corrected temperature range on industrial models. See
Ordering Guide ...................................................... 44
Added
Family Core Architecture ........................................ 3
Memory and I/O Interface Features ........................... 4
Target Board JTAG Emulator Connector .................... 8
Development Tools ............................................... 8
Evaluation Kit ...................................................... 9
Designing an Emulator-Compatible DSP Board (Target) 9
Additional Information .......................................... 9
Address Data Pins as Flags .................................... 13
Core Instruction Rate to CLKIN Ratio Modes ............ 13
Address Data Modes ............................................ 13
Operating Conditions .......................................... 14
Automotive Products ..................................... 44
Operating Conditions ....... 14
Rev. F | Page 2 of 44 | July 2009
144-Lead LQFP Pin Configurations ............................ 38
136-Ball BGA Pin Configurations ............................... 39
Outline Dimensions ................................................ 42
Automotive Products .............................................. 44
Ordering Guide ..................................................... 44
Electrical Characteristics ....................................... 14
Package Information ............................................ 15
ESD Caution ...................................................... 15
Maximum Power Dissipation ................................. 15
Absolute Maximum Ratings ................................... 15
Timing Specifications ........................................... 15
Output Drive Currents ......................................... 36
Test Conditions .................................................. 36
Capacitive Loading .............................................. 36
Environmental Conditions .................................... 37
Thermal Characteristics ........................................ 37
Surface-Mount Design .......................................... 43

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