ADSP-BF514BBCZ-4F4 Analog Devices Inc, ADSP-BF514BBCZ-4F4 Datasheet - Page 56

• Manufacturer Part Number: ADSP-BF514BBCZ-4F4
• Description: Low-Pwr BF Proc W/flash & Cnsmr Conctvty
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF514BBCZ-4F4

• Interface: I²C, PPI, RSI, SPI, SPORT, UART/USART
• Clock Rate: 400MHz
• Non-volatile Memory: FLASH (4Mbit)
• On-chip Ram: 116kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.30V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 168-LFBGA
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 400MHz
• Device Input Clock Speed: 400MHz
• Ram Size: 48KB
• Program Memory Size: 1024KB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Package: 168CSP-BGA
• Numeric And Arithmetic Format: Fixed-Point
• Maximum Speed: 400 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
Ψ
P
for the method to calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
Values of θ
circuit board design considerations when an external heat sink
is required.
Values of θ
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
The LQFP_EP package requires thermal trace squares and ther-
mal vias to an embedded ground plane in the PCB. The paddle
must be connected to ground for proper operation to data sheet
specifications. Refer to JEDEC standard JESD51-5 for more
information.
D
J
CASE
A
JT
= Junction temperature (°C)
Table
= Power dissipation (see
= Ambient temperature (°C)
= From
= Case temperature (°C) measured by customer at top
51, airflow measurements comply with JEDEC stan-
JA
JC
JB
Table 51
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
T
J
T
=
J
=
T
J
CASE
T
by the equation:
Total Power Dissipation on Page 23
A
D
)
+
+
(
θ
(
JA
Ψ
JT
×
JA
P
×
can be used for a first
D
P
)
D
)
Rev. B | Page 56 of 68 | January 2011
Table 50. Thermal Characteristics for SQ-176-2 Package
Table 51. Thermal Characteristics for BC-168-1 Package
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JT
JT
JT
JT
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
17.4
14.8
14.0
7.8
0.28
0.39
0.48
Typical
30.5
27.6
26.3
11.1
0.20
0.35
0.45
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W