AM29DL323GB90EI AMD (ADVANCED MICRO DEVICES), AM29DL323GB90EI Datasheet - Page 6

• Manufacturer Part Number: AM29DL323GB90EI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29DL323GB90EI

• Memory Configuration: 4M X 8 / 2M X 16 Bit
• Supply Voltage Max: 3.6V
• Access Time, Tacc: 90nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

CONNECTION DIAGRAMS
Special Package Handling Instructions
Special handling is required for Flash Memory prod-
ucts in molded packages (TSOP, BGA, PLCC, SSOP).
6
RY/BY#
A13
WE#
A4
A3
A2
A1
A6
A5
A9
A7
A3
A D V A N C E
RY/BY#
WP#/ACC
RESET#
WE#
A13
NC
A6
A9
A5
A4
A3
A2
A1
NC
A8
A7
A7
A3
A12
A17
B6
B5
A8
B4
B3
B2
B1
A4
WP#/ACC
RESET#
48-Ball Fine-pitch BGA (6 x 12 mm)
A12
A17
NC
B6
B5
B4
B3
B2
B1
NC
A8
B8
B7
A4
A14
A10
A18
NC
C6
C5
C4
C3
C2
A6
C1
A2
64-Ball Fortified BGA (11 x 13 mm)
Top View, Balls Facing Down
Top View, Balls Facing Down
Am29DL32xG
A14
A10
A18
NC
NC
NC
C8
C7
C6
C5
C4
C3
A6
C2
A2
C1
A15
A11
A19
A20
D6
D5
D4
D3
D2
A5
D1
A1
I N F O R M A T I O N
V
A15
A11
A19
A20
NC
D8
D7
D6
D5
D4
D3
D2
D1
A5
A1
CCQ
DQ7
DQ5
DQ2
DQ0
A16
E6
E5
E4
E3
E2
E1
A0
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150
°
BYTE#
DQ7
DQ5
DQ2
DQ0
V
A16
DQ14
DQ12
DQ10
NC
C for prolonged periods of time.
E8
E7
E6
E5
E4
E3
E2
A0
E1
DQ8
CE#
SS
F6
F5
F4
F3
F2
F1
DQ15/A-1
BYTE#
DQ14
DQ12
DQ10
V
DQ8
DQ13
DQ11
CE#
DQ9
OE#
NC
V CC
F8
F7
F6
F5
F4
F3
F2
F1
CCQ
G6
G5
G4
G3
G2
G1
DQ15
DQ13
DQ11
DQ9
OE#
V
DQ6
DQ4
DQ3
DQ1
G8
NC
G7
G6
G5
G4
G3
G2
G1
NC
V SS
V SS
H6
H5
H4
H3
H2
H1
CC
DQ6
DQ4
DQ3
DQ1
V
V
NC
H8
NC
H7
H6
H5
H4
H3
H2
H1
SS
SS
March 26, 2004