AM29DL323GB90EI AMD (ADVANCED MICRO DEVICES), AM29DL323GB90EI Datasheet - Page 8

• Manufacturer Part Number: AM29DL323GB90EI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29DL323GB90EI

• Memory Configuration: 4M X 8 / 2M X 16 Bit
• Supply Voltage Max: 3.6V
• Access Time, Tacc: 90nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

CONNECTION DIAGRAMS
Special Package Handling Instructions
Special handling is required for Flash Memory prod-
ucts in molded packages (TSOP, BGA, PLCC, SSOP).
6
RY/BY#
A13
WE#
A4
A3
A2
A1
A6
A5
A9
A7
A3
RY/BY#
WP#/ACC
WE#
RESET#
RFU
RFU
A13
A6
A9
A5
A4
A3
A2
A1
A8
A7
A7
A3
A12
A17
B6
B5
A8
B4
B3
B2
B1
A4
WP#/ACC
RESET#
48-Ball Fine-pitch BGA (6 x 12 mm)
RFU
RFU
A12
A17
B6
B5
B4
B3
B2
B1
A8
B8
B7
A4
A14
A10
A18
C6
C5
C4
NC
C3
C2
A6
C1
A2
D A T A
64-Ball Fortified BGA (11 x 13 mm)
Top View, Balls Facing Down
Top View, Balls Facing Down
Am29DL32xG
RFU
RFU
A14
A10
A21
A18
C8
C7
C6
C5
C4
C3
A6
C2
A2
C1
A15
A11
A19
A20
D6
D5
D4
D3
D2
A5
D1
A1
V
RFU
A15
A11
A19
A20
S H E E T
D8
D7
D6
D5
D4
D3
D2
D1
A5
A1
CCQ
DQ7
DQ5
DQ2
DQ0
A16
E6
E5
E4
E3
E2
E1
A0
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150
°
DQ7
DQ5
DQ2
DQ0
RFU
BYTE#
V
A16
C for prolonged periods of time.
DQ14
DQ12
DQ10
E8
E7
E6
E5
E4
E3
E2
A0
E1
DQ8
CE#
SS
F6
F5
F4
F3
F2
F1
DQ15/A-1
BYTE#
DQ14
DQ12
DQ10
V
RFU
DQ8
CE#
DQ13
DQ11
V CC
DQ9
OE#
F8
F7
F6
F5
F4
F3
F2
F1
CCQ
G6
G5
G4
G3
G2
G1
DQ15
DQ13
DQ11
RFU
DQ9
OE#
RFU
V
G8
G7
G6
G5
G4
G3
G2
G1
DQ6
DQ4
DQ3
DQ1
V SS
V SS
H6
H5
H4
H3
H2
H1
CC
DQ6
DQ4
DQ3
DQ1
RFU
V
V
RFU
H8
H7
H6
H5
H4
H3
H2
H1
SS
SS
25686B10 December 4, 2006