AM29DL323GB90EI AMD (ADVANCED MICRO DEVICES), AM29DL323GB90EI Datasheet - Page 10

• Manufacturer Part Number: AM29DL323GB90EI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29DL323GB90EI

• Memory Configuration: 4M X 8 / 2M X 16 Bit
• Supply Voltage Max: 3.6V
• Access Time, Tacc: 90nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
8
AM29DL322GT70,
AM29DL322GB70
AM29DL323GT70
AM29DL323GB70
AM29DL324GT70,
AM29DL324GB70
AM29DL322GT90,
AM29DL322GB90
AM29DL323GT90,
AM29DL323GB90
AM29DL324GT90,
AM29DL324GB90
AM29DL322GT120,
AM29DL322GB120
AM29DL323GT120,
AM29DL323GB120
AM29DL324GT120,
AM29DL324GB120
Am29DL32xG
Valid Combinations for TSOP Packages
T
DEVICE NUMBER/DESCRIPTION
Am29DL32xG
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
70
E
I
EI, EIN,
EF
D A T A
OPTIONAL PROCESSING
Blank =
N
(Contact an AMD representative for more information)
TEMPERATURE RANGE
I
F
PACKAGE TYPE
E
WD
WM
PC
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
Am29DL32xG
=
=
=
=
=
=
=
=
=
Standard Processing
16-byte ESN devices
Industrial (–40
Industrial (–40
48-Pin Thin Small Outline Package
(TSOP) Standard Pinout (TS 048)
63-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 14 mm package (FBD063)
48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 12 mm package (FBD048)
64-Ball Fortified Pitch Ball Grid Array (FBGA)
1.00 mm pitch, 11 x 13 mm package (LAA064)
Top sector
Bottom sector
S H E E T
AM29DL322GT70,
AM29DL322GB70
AM29DL323GT70,
AM29DL323GB70
AM29DL324GT70,
AM29DL324GB70
AM29DL322GT90,
AM29DL322GB90
AM29DL323GT90,
AM29DL323GB90
AM29DL324GT90,
AM29DL324GB90
AM29DL322GT120,
AM29DL322GB120
AM29DL323GT120,
AM29DL323GB120
AM29DL324GT120,
AM29DL324GB120
°
°
C to +85
C to +85
Order Number
Valid Combinations for FBGA Packages
°
°
C)
C) with Pb-free package
WMIN,
WMI,
WMF
25686B10 December 4, 2006
D322GT70U,
D322GB70U
D323GT70U,
D323GB70U
D324GT70U,
D324GB70U
D322GT90U,
D322GB90U
D323GT90U,
D323GB90U
D324GT90U,
D324GB90U
D322GT12U,
D322GB12U
D323GT12U,
D323GB12U
D324GT12U,
D324GB12U
Package Marking
I, F