CY7C1480BV33-200AXC Cypress Semiconductor Corp, CY7C1480BV33-200AXC Datasheet - Page 9

CY7C1480BV33-200AXC

CY7C1480BV33-200AXC

Manufacturer Part Number
CY7C1480BV33-200AXC
Description
CY7C1480BV33-200AXC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1480BV33-200AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1480BV33-200AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Pin Definitions
Functional Overview
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. Maximum
access delay from the clock rise (t
The CY7C1480BV33, CY7C1482BV33, and CY7C1486BV33
support secondary cache in systems using either a linear or
interleaved burst sequence. The interleaved burst order
supports Pentium and i486 processors. The linear burst
sequence is suited for processors that use a linear burst
sequence. The burst order is user selectable, and is determined
by sampling the MODE input. Accesses may be initiated with the
Processor Address Strobe (ADSP) or the Controller Address
Strobe (ADSC). Address advancement through the burst
sequence is controlled by the ADV input. A two-bit on-chip
wraparound burst counter captures the first address in a burst
sequence and automatically increments the address for the rest
of the burst access.
Byte Write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BW
Enable (GW) overrides all byte write inputs and writes data to all
four bytes. All writes are simplified with on-chip synchronous
self-timed write circuitry.
Three synchronous Chip Selects (CE
asynchronous Output Enable (OE) provide easy bank selection
and output tri-state control. ADSP is ignored if CE
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) CE
signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if
CE
is stored into the address advancement logic and the Address
Register while being presented to the memory array. The
Document Number: 001-15145 Rev. *E
V
MODE
TDO
TDI
TMS
TCK
NC
Pin Name
DDQ
1
is HIGH. The address presented to the address inputs (A)
1
, CE
2
, CE
3
are all asserted active, and (3) the write
(continued)
IO Power Supply Power supply for the IO circuitry.
Synchronous
Synchronous
Synchronous
JTAG Serial
JTAG Serial
JTAG Serial
JTAG Clock
Input Static
Output
Input
Input
IO
CO
) is 3.0 ns (250 MHz device).
X
) inputs. A Global Write
1
, CE
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to V
or left floating selects interleaved burst sequence. This is a strap pin and must remain
static during device operation. Mode Pin has an internal pull up.
Serial Data-Out to the JTAG Circuit. Delivers data on the negative edge of TCK. If the
JTAG feature is not used, this pin must be disconnected. This pin is not available on
TQFP packages.
Serial Data-In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG
feature is not used, this pin can be disconnected or connected to V
available on TQFP packages.
Serial Data-In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG
feature is not used, this pin can be disconnected or connected to V
available on TQFP packages.
Clock Input to the JTAG Circuitry. If the JTAG feature is not used, this pin must be
connected to V
No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are
address expansion pins and are not internally connected to the die.
2
, and CE
1
is HIGH.
3
) and an
SS
. This pin is not available on TQFP packages.
corresponding data is allowed to propagate to the input of the
Output Registers. At the rising edge of the next clock the data is
allowed to propagate through the output register and onto the
data bus within 3.0 ns (250 MHz device) if OE is active LOW. The
only exception occurs when the SRAM is emerging from a
deselected state to a selected state; its outputs are always
tri-stated during the first cycle of the access. After the first cycle
of the access, the outputs are controlled by the OE signal.
Consecutive single read cycles are supported. After the SRAM
is deselected at clock rise by the chip select and either ADSP or
ADSC signals, its output tri-states immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions are
satisfied at clock rise: (1) ADSP is asserted LOW, and (2) CE
CE
loaded into the address register and the address advancement
logic while being delivered to the memory array. The write signals
(GW, BWE, and BW
first cycle.
ADSP triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the corre-
sponding address location in the memory array. If GW is HIGH,
then the write operation is controlled by BWE and BW
The CY7C1480BV33, CY7C1482BV33, and CY7C1486BV33
provide byte write capability that is described in the section
Table for Read/Write on page
Enable input (BWE) with the selected Byte Write (BW
selectively writes to only the desired bytes. Bytes not selected
during a Byte Write operation remain unaltered. A synchronous
self-timed Write mechanism is provided to simplify the Write
operations.
Because
CY7C1486BV33 are a common IO device, the Output Enable
(OE) must be deasserted HIGH before presenting data to the
2
, CE
3
CY7C1482BV33, CY7C1486BV33
are all asserted active. The address presented to A is
Description
the
CY7C1480BV33,
X
) and ADV inputs are ignored during this
12. Asserting the Byte Write
CY7C1480BV33
CY7C1482BV33,
DD
DD
. This pin is not
. This pin is not
Page 9 of 35
X
X
signals.
) input,
Truth
DD
and
1
[+] Feedback
,

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