CY7C1480V33-250BZI Cypress Semiconductor Corp, CY7C1480V33-250BZI Datasheet - Page 20

• Manufacturer Part Number: CY7C1480V33-250BZI
• Description: CY7C1480V33-250BZI
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1480V33-250BZI

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 72M (2M x 36)
• Speed: 250MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 165-LFBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Document #: 38-05283 Rev. *G
AC Test Loads and Waveforms
Note:
Capacitance
Thermal Resistance
14. Tested initially and after any design or process change that may affect these parameters.
C
C
C
C
C
ADDRESS
DATA
CTRL
CLK
I/O
OUTPUT
OUTPUT
Parameter
Parameter
3.3V I/O Test Load
2.5V I/O Test Load
Θ
Θ
JA
JC
[14]
Z
Z
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
0
0
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
= 50Ω
= 50Ω
(a)
(a)
Description
V
Description
V
[14]]
L
L
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
3.3V
2.5V
INCLUDING
INCLUDING
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
JIG AND
JIG AND
SCOPE
SCOPE
T
A
5 pF
5 pF
Test Conditions
Test Conditions
= 25°C, f = 1 MHz,
V
V
DDQ
DD
= 3.3V
(b)
(b)
= 2.5V
R = 317Ω
R = 1667Ω
R = 351Ω
R = 1538Ω
100 TQFP
Package
100 TQFP
V
24.63
GND
GND
V
DDQ
2.28
Max.
DDQ
6
5
8
6
5
≤ 1 ns
≤ 1 ns
10%
10%
165 FBGA
165 FBGA
Package
16.3
ALL INPUT PULSES
ALL INPUT PULSES
Max.
2.1
6
5
8
6
5
90%
90%
(c)
(c)
CY7C1480V33
CY7C1482V33
CY7C1486V33
209 FBGA
209 FBGA
Package
Max.
15.2
1.7
6
5
8
6
5
Page 20 of 31
90%
90%
10%
10%
°C/W
°C/W
≤ 1 ns
≤ 1 ns
Unit
Unit
pF
pF
pF
pF
pF
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