CY7C1480V33-250BZI Cypress Semiconductor Corp, CY7C1480V33-250BZI Datasheet - Page 31

CY7C1480V33-250BZI

CY7C1480V33-250BZI

Manufacturer Part Number
CY7C1480V33-250BZI
Description
CY7C1480V33-250BZI
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1480V33-250BZI

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
250MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1480V33-250BZI
Manufacturer:
CYPRESS
Quantity:
101
Part Number:
CY7C1480V33-250BZI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document #: 38-05283 Rev. *G
.Document History Page
Document Title: CY7C1480V33/CY7C1482V33/CY7C1486V33 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
Document Number: 38-05283
REV.
*C
*D
*G
*A
*B
*E
*F
**
ECN NO. Issue Date
114670
118281
233368
299452
323080
416193
470723
486690
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
08/06/02
01/21/03
Change
Orig. of
HGK
NXR
VKN
VKN
PKS
NJY
SYT
PCI
New Data Sheet
Changed t
Updated features on page 1 for package offering
Removed 30-MHz offering
Updated Ordering Information
Changed Advanced Information to Preliminary
Changed timing diagrams
Changed logic block diagrams
Modified Functional Description
Modified “Functional Overview” section
Added boundary scan order for all packages
Included thermal numbers and capacitance values for all packages
Included IDD and ISB values
Removed 250-MHz speed grade offering and included 225-MHz speed bin
Changed package outline for 165FBGA package and 209-ball BGA package
Removed 119-BGA package offering
Removed 225-MHz offering and included 250-MHz speed bin
Changed t
Changed Θ
TQFP Package on Page # 20
Added lead-free information for 100-Pin TQFP, 165 FBGA and 209 BGA
Packages
Added comment of ‘Lead-free BG packages availability’ below the Ordering
Information
Unshaded 200 and 167 MHz speed bin in the AC/DC Table and Selection
Guide
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Added Address Expansion pins in the Pin Definitions Table
Added Truth Table and Note# 7 for CY7C1486V33 on page# 11
Added Industrial Operating Range
Modified V
Removed comment of ‘Lead-free BG packages availability’ below the
Ordering Information
Updated Ordering Information Table
Converted Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed the description of I
Current on page# 19
Changed the I
to -30 µA and 5 µA
Changed the I
to -5 µA and 30 µA
Changed V
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated the Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
Switching Characteristics table
Updated the Ordering Information table
Corrected the typo in the 209-Ball FBGA pinout.
(Corrected the ball name H9 to V
CO
CYC
TH
OL,
JA
IH
,t
from 2.4 to 2.6 ns for 250 MHz
from 16.8 to 24.63 °C/W and Θ
< V
X
TL
V
X
from 4.4 ns to 4.0 ns for 250-MHz Speed Bin
OH
current values of MODE on page # 19 from -5 µA and 30 µA
current values of ZZ on page # 19 from -30 µA and 5 µA
from 25 ns to 20 ns and t
DD
test conditions
to V
IH
Description of Change
< V
X
from Input Load Current to Input Leakage
DD
SS
on page # 19
from V
TDOV
SSQ
JC
from 3.3 to 2.28 °C/W for 100
from 5 ns to 10 ns in TAP AC
).
CY7C1480V33
CY7C1482V33
CY7C1486V33
DDQ
Relative to GND
Page 31 of 31
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