DAC1005D650HW/C1:5 NXP Semiconductors, DAC1005D650HW/C1:5 Datasheet - Page 8

• Manufacturer Part Number: DAC1005D650HW/C1:5
• Description: DAC1005D650HW/HTQFP100/TRAYBDP
• Manufacturer: NXP Semiconductors

Specifications of DAC1005D650HW/C1:5

• Settling Time: 20ns
• Number Of Bits: 10
• Data Interface: SPI™
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 1.4W
• Operating Temperature: -45°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935286776551

NXP Semiconductors
7. Limiting values
Table 3.
In accordance with the Absolute Maximum Rating System (IEC 60134).
8. Thermal characteristics
Table 4.
[1]
DAC1005D650
Product data sheet
Symbol
V
V
V
V
V
V
T
T
T
Symbol
R
R
stg
amb
j
DD(IO)(3V3)
DDA(3V3)
DDA(1V8)
DDD(1V8)
I
O
th(j-a)
th(j-c)
In compliance with JEDEC test board, in free air.
Limiting values
Thermal characteristics
Parameter
input/output supply voltage (3.3 V)
analog supply voltage (3.3 V)
analog supply voltage (1.8 V)
digital supply voltage (1.8 V)
input voltage
output voltage
storage temperature
ambient temperature
junction temperature
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 September 2010
Conditions
pins CLKP, CLKN, VIRES and GAPOUT
referenced to AGND
pins I9 to I0, Q9 to Q0, SDO, SDIO, SCLK,
SCS_N and RESET_N referenced to GNDIO
pins IOUTAP, IOUTAN, IOUTBP, IOUTBN,
AUXAP, AUXAN, AUXBP and AUXBN
referenced to AGND
Dual 10-bit DAC, up to 650 Msps; 2× 4× and 8× interpolating
Conditions
DAC1005D650
Min
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−55
−45
-
[1]
[1]
Typ
19.8
7.7
© NXP B.V. 2010. All rights reserved.
Max
+4.6
+4.6
+3.0
+3.0
+3.0
+4.6
+4.6
+150
+85
125
Unit
K/W
K/W
Unit
V
V
V
V
V
V
V
°C
°C
°C
8 of 42