TGF2961-SD-T/R TriQuint, TGF2961-SD-T/R Datasheet - Page 20

• Manufacturer Part Number: TGF2961-SD-T/R
• Description: RF GaAs DC-4Hz 1 Watt HFET
• Manufacturer: TriQuint

Specifications of TGF2961-SD-T/R

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1061560

FOR 2-56 SOCKET HEAD CAP SCREW (2/)
KEEPOUT FOR 2-56 LOCKWASHER (4/)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
1/ The lowest possible thermal and electrical resistance for Pin 2 is critical for optimal performance. The array
of vias under Pin 2 should be as small and as dense as the PC board fabrication permits. 0.30 mm diameter
vias on 0.60 mm center to center spacing is recommended.
2/ Mounting screws in the vicinity of the package improve heat transfer to the chassis or to a heat spreader
located on the backside of the PC board. Shown are clearance holes and solder mask keepout zone for a 2-
56 socket head cap screw. Use of a split lockwasher and proper torque on the screw will prevent
compression damage to the PC board.
3/ Use of 1 oz copper (min) in the PC board construction is recommended.
4/ For lowest thermal resistance, solder mask must be removed where the copper traces on the PC board
contact the heat spreader. In this example, this would be a) front and backsides of the PC board around the
2-56 screw and b) front of the PC board around package pin 2.
2.6 mm Ø CLEARANCE HOLE
4.6 mm Ø SOLDERMASK
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Recommended Assembly Diagram
Assembly Notes
September 2010 © Rev B
1
2
3
7.6 X 7.6 mm COPPER AREA (3/)
ARRAY OF VIAS (1/)
SOT-89 PACKAGE OUTLINE
TGF2961-SD
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