TGF2961-SD-T/R TriQuint, TGF2961-SD-T/R Datasheet - Page 21

• Manufacturer Part Number: TGF2961-SD-T/R
• Description: RF GaAs DC-4Hz 1 Watt HFET
• Manufacturer: TriQuint

Specifications of TGF2961-SD-T/R

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1061560

Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Time within 5 °C of Peak
Max Peak Temperature
Activation Time and
Activation Time and
Reflow Profile
Ramp-down Rate
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Ramp-up Rate
Temperature
Temperature
TGF2961-SD, TAPE AND REEL
Recommended Surface Mount Package Assembly
Part
Ordering Information
Typical Solder Reflow Profiles
60 – 120 sec @ 140 – 160 °C
60 – 120 sec @ 140 – 160 °C
September 2010 © Rev B
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
SnPb
240 °C
SOT-89, TAPE AND REEL
Package Style
60 – 180 sec @ 150 – 200 °C
60 – 180 sec @ 150 – 200 °C
TGF2961-SD
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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