BAS16VV,115 NXP Semiconductors, BAS16VV,115 Datasheet - Page 15

• Manufacturer Part Number: BAS16VV,115
• Description: DIODE SW 100V 200MA H-S SOT666
• Manufacturer: NXP Semiconductors

Specifications of BAS16VV,115

• Package / Case: SS Mini-6 (SOT-666)
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 3 Independent
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 4 A
• Configuration: Triple Parallel
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 1 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Rectifier Type: Switching Diode
• Peak Rep Rev Volt: 100V
• Avg. Forward Curr (max): 0.2A
• Rev Curr: 0.5uA
• Peak Non-repetitive Surge Current (max): 4A
• Forward Voltage: 1.25@0.15AV
• Operating Temp Range: -65C to 150C
• Package Type: SOT-666
• Rev Recov Time: 4ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934058225115; BAS16VV T/R; BAS16VV T/R

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 25. Wave soldering footprint BAS16VY (SOT363/SC-88)
Fig 26. Reflow soldering footprint BAS16W (SOT323/SC-70)
4.5
2.35
(3 )
0.6
1.3
0.55
(3 )
Rev. 05 — 25 August 2008
2.45
3
5.3
2.65
1.85
1.3
1.325
2
1
(3 )
0.5
1.5
1.5
1.3
0.3
2.5
High-speed switching diodes
BAS16 series
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
preferred transport
solder lands
solder resist
solder paste
occupied area
sot323_fr
solder lands
solder resist
occupied area
sot363_fw
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